Laser-Driven Light Source

ABSTRACT

An apparatus for producing light includes a chamber and an ignition source that ionizes a gas within the chamber. The apparatus also includes at least one laser that provides energy to the ionized gas within the chamber to produce a high brightness light. The laser can provide a substantially continuous amount of energy to the ionized gas to generate a substantially continuous high brightness light.

RELATED APPLICATIONS

This application is a continuation of U.S. Ser. No. 13/024,027, filed onFeb. 9, 2011, which is a continuation-in-part of U.S. Ser. No.12/166,918, filed on Jul. 2, 2008, now U.S. Pat. No. 7,989,786, which isa continuation-in-part of U.S. Ser. No. 11/695,348, filed on Apr. 2,2007, now U.S. Pat. No. 7,786,455, which is a continuation-in-part ofU.S. Ser. No. 11/395,523, filed on Mar. 31, 2006, now U.S. Pat. No.7,435,982, the entire disclosures each of which are hereby incorporatedby reference herein. This application claims the benefit of, andpriority to U.S. Provisional Patent Application No. 61/302,797, filed onFeb. 9, 2010, the entire disclosure of which is incorporated byreference herein.

FIELD OF THE INVENTION

The invention relates to methods and apparatus for providing alaser-driven light source.

BACKGROUND OF THE INVENTION

High brightness light sources can be used in a variety of applications.For example, a high brightness light source can be used for inspection,testing or measuring properties associated with semiconductor wafers ormaterials used in the fabrication of wafers (e.g., reticles andphotomasks). The electromagnetic energy produced by high brightnesslight sources can, alternatively, be used as a source of illumination ina lithography system used in the fabrication of wafers, a microscopysystem, or a photoresist curing system. The parameters (e.g.,wavelength, power level and brightness) of the light vary depending uponthe application.

The state of the art in, for example, wafer inspection systems involvesthe use of xenon or mercury arc lamps to produce light. The arc lampsinclude an anode and cathode that are used to excite xenon or mercurygas located in a chamber of the lamp. An electrical discharge isgenerated between the anode and cathode to provide power to the excited(e.g., ionized) gas to sustain the light emitted by the ionized gasduring operation of the light source. During operation, the anode andcathode become very hot due to electrical discharge delivered to theionized gas located between the anode and cathode. As a result, theanode and/or cathode are prone to wear and may emit particles that cancontaminate the light source or result in failure of the light source.Also, these arc lamps do not provide sufficient brightness for someapplications, especially in the ultraviolet spectrum. Further, theposition of the arc can be unstable in these lamps.

Accordingly, a need therefore exists for improved high brightness lightsources. A need also exists for improved high brightness light sourcesthat do not rely on an electrical discharge to maintain a plasma thatgenerates a high brightness light.

The properties of light produced by many light sources (e.g., arc lamps,microwave lamps) are affected when the light passes through a wall of,for example, a chamber that includes the location from which the lightis emitted.

Accordingly, a need therefore exists for an improved light source whoseemitted light is not significantly affected when the light passesthrough a wall of a chamber that includes the location from which thelight is emitted.

SUMMARY OF THE INVENTION

The present invention features a light source for generating a highbrightness light.

The invention, in one aspect, features a light source having a chamber.The light source also includes an ignition source for ionizing a gaswithin the chamber. The light source also includes at least one laserfor providing energy to the ionized gas within the chamber to produce ahigh brightness light.

In some embodiments, the at least one laser is a plurality of lasersdirected at a region from which the high brightness light originates. Insome embodiments, the light source also includes at least one opticalelement for modifying a property of the laser energy provided to theionized gas. The optical element can be, for example, a lens (e.g., anaplanatic lens, an achromatic lens, a single element lens, and a fresnellens) or mirror (e.g., a coated mirror, a dielectric coated mirror, anarrow band mirror, and an ultraviolet transparent infrared reflectingmirror). In some embodiments, the optical element is one or more fiberoptic elements for directing the laser energy to the gas.

The chamber can include an ultraviolet transparent region. The chamberor a window in the chamber can include a material selected from thegroup consisting of quartz, Suprasil® quartz (Heraeus Quartz America,LLC, Buford, Ga.), sapphire, MgF₂, diamond, and CaF₂. In someembodiments, the chamber is a sealed chamber. In some embodiments, thechamber is capable of being actively pumped. In some embodiments, thechamber includes a dielectric material (e.g., quartz). The chamber canbe, for example, a glass bulb. In some embodiments, the chamber is anultraviolet transparent dielectric chamber.

The gas can be one or more of a noble gas, Xe, Ar, Ne, Kr, He, D₂, H₂,O₂, F₂, a metal halide, a halogen, Hg, Cd, Zn, Sn, Ga, Fe, Li, Na, anexcimer forming gas, air, a vapor, a metal oxide, an aerosol, a flowingmedia, or a recycled media. The gas can be produced by a pulsed laserbeam that impacts a target (e.g., a solid or liquid) in the chamber. Thetarget can be a pool or film of metal. In some embodiments, the targetis capable of moving. For example, the target may be a liquid that isdirected to a region from which the high brightness light originates.

In some embodiments, the at least one laser is multiple diode laserscoupled into a fiber optic element. In some embodiments, the at leastone laser includes a pulse or continuous wave laser. In someembodiments, the at least one laser is an IR laser, a diode laser, afiber laser, an ytterbium laser, a CO₂ laser, a YAG laser, or a gasdischarge laser. In some embodiments, the at least one laser emits atleast one wavelength of electromagnetic energy that is strongly absorbedby the ionized medium.

The ignition source can be or can include electrodes, an ultravioletignition source, a capacitive ignition source, an inductive ignitionsource, an RF ignition source, a microwave ignition source, a flashlamp, a pulsed laser, or a pulsed lamp. The ignition source can be acontinuous wave (CW) or pulsed laser impinging on a solid or liquidtarget in the chamber. The ignition source can be external or internalto the chamber.

The light source can include at least one optical element for modifyinga property of electromagnetic radiation emitted by the ionized gas. Theoptical element can be, for example, one or more mirrors or lenses. Insome embodiments, the optical element is configured to deliver theelectromagnetic radiation emitted by the ionized gas to a tool (e.g., awafer inspection tool, a microscope, a metrology tool, a lithographytool, or an endoscopic tool).

The invention, in another aspect, relates to a method for producinglight. The method involves ionizing with an ignition source a gas withina chamber. The method also involves providing laser energy to theionized gas in the chamber to produce a high brightness light.

In some embodiments, the method also involves directing the laser energythrough at least one optical element for modifying a property of thelaser energy provided to the ionized gas. In some embodiments, themethod also involves actively pumping the chamber. The ionizable mediumcan be a moving target. In some embodiments, the method also involvesdirecting the high brightness light through at least one optical elementto modify a property of the light. In some embodiments, the method alsoinvolves delivering the high brightness light emitted by the ionizedmedium to a tool (e.g., a wafer inspection tool, a microscope, ametrology tool, a lithography tool, or an endoscopic tool).

In another aspect, the invention features a light source. The lightssource includes a chamber and an ignition source for ionizing anionizable medium within the chamber. The light source also includes atleast one laser for providing substantially continuous energy to theionized medium within the chamber to produce a high brightness light.

In some embodiments, the at least one laser is a continuous wave laseror a high pulse rate laser. In some embodiments, the at least one laseris a high pulse rate laser that provides pulses of energy to the ionizedmedium so the high brightness light is substantially continuous. In someembodiments, the magnitude of the high brightness light does not vary bymore than about 90% during operation. In some embodiments, the at leastone laser provides energy substantially continuously to minimize coolingof the ionized medium when energy is not provided to the ionized medium.

In some embodiments, the light source can include at least one opticalelement (e.g., a lens or mirror) for modifying a property of the laserenergy provided to the ionized medium. The optical element can be, forexample, an aplanatic lens, an achromatic lens, a single element lens, afresnel lens, a coated mirror, a dielectric coated mirror, a narrow bandmirror, or an ultraviolet transparent infrared reflecting mirror. Insome embodiments, the optical element is one or more fiber opticelements for directing the laser energy to the ionizable medium.

In some embodiments, the chamber includes an ultraviolet transparentregion. In some embodiments, the chamber or a window in the chamberincludes a quartz material, suprasil quartz material, sapphire material,MgF₂ material, diamond material, or CaF₂ material. In some embodiments,the chamber is a sealed chamber. The chamber can be capable of beingactively pumped. In some embodiments, the chamber includes a dielectricmaterial (e.g., quartz). In some embodiments, the chamber is a glassbulb. In some embodiments, the chamber is an ultraviolet transparentdielectric chamber.

The ionizable medium can be a solid, liquid or gas. The ionizable mediumcan include one or more of a noble gas, Xe, Ar, Ne, Kr, He, D₂, H₂, O₂,F₂, a metal halide, a halogen, Hg, Cd, Zn, Sn, Ga, Fe, Li, Na, anexcimer forming gas, air, a vapor, a metal oxide, an aerosol, a flowingmedia, a recycled media, or an evaporating target. In some embodiments,the ionizable medium is a target in the chamber and the ignition sourceis a pulsed laser that provides a pulsed laser beam that strikes thetarget. The target can be a pool or film of metal. In some embodiments,the target is capable of moving.

In some embodiments, the at least one laser is multiple diode laserscoupled into a fiber optic element. The at least one laser can emit atleast one wavelength of electromagnetic energy that is strongly absorbedby the ionized medium.

The ignition source can be or can include electrodes, an ultravioletignition source, a capacitive ignition source, an inductive ignitionsource, an RF ignition source, a microwave ignition source, a flashlamp, a pulsed laser, or a pulsed lamp. The ignition source can beexternal or internal to the chamber.

In some embodiments, the light source includes at least one opticalelement (e.g., a mirror or lens) for modifying a property ofelectromagnetic radiation emitted by the ionized medium. The opticalelement can be configured to deliver the electromagnetic radiationemitted by the ionized medium to a tool (e.g., a wafer inspection tool,a microscope, a metrology tool, a lithography tool, or an endoscopictool).

The invention, in another aspect relates to a method for producinglight. The method involves ionizing with an ignition source an ionizablemedium within a chamber. The method also involves providingsubstantially continuous laser energy to the ionized medium in thechamber to produce a high brightness light.

In some embodiments, the method also involves directing the laser energythrough at least one optical element for modifying a property of thelaser energy provided to the ionizable medium. The method also caninvolve actively pumping the chamber. In some embodiments, the ionizablemedium is a moving target. The ionizable medium can include a solid,liquid or gas. In some embodiments, the method also involves directingthe high brightness light through at least one optical element to modifya property of the light. In some embodiments, the method also involvesdelivering the high brightness light emitted by the ionized medium to atool.

The invention, in another aspect, features a light source having achamber. The light source includes a first ignition means for ionizingan ionizable medium within the chamber. The light source also includes ameans for providing substantially continuous laser energy to the ionizedmedium within the chamber.

The invention, in another aspect, features a light source having achamber that includes a reflective surface. The light source alsoincludes an ignition source for ionizing a gas within the chamber. Thelight source also includes a reflector that at least substantiallyreflects a first set of predefined wavelengths of electromagnetic energydirected toward the reflector and at least substantially allows a secondset of predefined wavelengths of electromagnetic energy to pass throughthe reflector. The light source also includes at least one laser (e.g.,a continuous-wave fiber laser) external to the chamber for providingelectromagnetic energy to the ionized gas within the chamber to producea plasma that generates a high brightness light. A continuous-wave laseremits radiation continuously or substantially continuously rather thanin short bursts, as in a pulsed laser.

In some embodiments, at least one laser directs a first set ofwavelengths of electromagnetic energy through the reflector toward thereflective surface (e.g., inner surface) of the chamber and thereflective surface directs at least a portion of the first set ofwavelengths of electromagnetic energy toward the plasma. In someembodiments, at least a portion of the high brightness light is directedtoward the reflective surface of the chamber, is reflected toward thereflector, and is reflected by the reflector toward a tool. In someembodiments, at least one laser directs a first set of wavelengths ofelectromagnetic energy toward the reflector, the reflector reflects atleast a portion of the first wavelengths of electromagnetic energytowards the reflective surface of the chamber, and the reflectivesurface directs a portion of the first set of wavelengths ofelectromagnetic energy toward the plasma.

In some embodiments, at least a portion of the high brightness light isdirected toward the reflective surface of the chamber, is reflectedtoward the reflector, and passes through the reflector toward an outputof the light source. In some embodiments, the light source comprises amicroscope, ultraviolet microscope, wafer inspection system, reticleinspection system or lithography system spaced relative to the output ofthe light source to receive the high brightness light. In someembodiments, a portion of the high brightness light is directed towardthe reflective surface of the chamber, is reflected toward thereflector, and electromagnetic energy comprising the second set ofpredefined wavelengths of electromagnetic energy passes through thereflector.

The chamber of the light source can include a window. In someembodiments, the chamber is a sealed chamber. In some embodiments, thereflective surface of the chamber comprises a curved shape, parabolicshape, elliptical shape, spherical shape or aspherical shape. In someembodiments, the chamber has a reflective inner surface. In someembodiments, a coating or film is located on the outside of the chamberto produce the reflective surface. In some embodiments, a coating orfilm is located on the inside of the chamber to produce the reflectivesurface. In some embodiments, the reflective surface is a structure oroptical element that is distinct from the inner surface of the chamber.

The light source can include an optical element disposed along a paththe electromagnetic energy from the laser travels. In some embodiments,the optical element is adapted to provide electromagnetic energy fromthe laser to the plasma over a large solid angle. In some embodiments,the reflective surface of the chamber is adapted to provideelectromagnetic energy from the laser to the plasma over a large solidangle. In some embodiments, the reflective surface of the chamber isadapted to collect the high brightness light generated by the plasmaover a large solid angle. In some embodiments, one or more of thereflective surface, reflector and the window include (e.g., are coatedor include) a material to filter predefined wavelengths (e.g., infraredwavelengths of electromagnetic energy) of electromagnetic energy.

The invention, in another aspect, features a light source that includesa chamber that has a reflective surface. The light source also includesan ignition source for ionizing a gas within the chamber. The lightsource also includes at least one laser external to the chamber forproviding electromagnetic energy to the ionized gas within the chamberto produce a plasma that generates a high brightness light. The lightsource also includes a reflector positioned along a path that theelectromagnetic energy travels from the at least one laser to thereflective surface of the chamber.

In some embodiments, the reflector is adapted to at least substantiallyreflect a first set of predefined wavelengths of electromagnetic energydirected toward the reflector and at least substantially allow a secondset of predefined wavelengths of electromagnetic energy to pass throughthe reflector.

The invention, in another aspect, relates to a method for producinglight. The method involves ionizing with an ignition source a gas withina chamber that has a reflective surface. The method also involvesproviding laser energy to the ionized gas in the chamber to produce aplasma that generates a high brightness light.

In some embodiments, the method involves directing the laser energycomprising a first set of wavelengths of electromagnetic energy througha reflector toward the reflective surface of the chamber, the reflectivesurface reflecting at least a portion of the first set of wavelengths ofelectromagnetic energy toward the plasma. In some embodiments, themethod involves directing at least a portion of the high brightnesslight toward the reflective surface of the chamber which is reflectedtoward the reflector and is reflected by the reflector toward a tool.

In some embodiments, the method involves directing the laser energycomprising a first set of wavelengths of electromagnetic energy towardthe reflector, the reflector reflects at least a portion of the firstwavelengths of electromagnetic energy toward the reflective surface ofthe chamber, the reflective surface directs a portion of the first setof wavelengths of electromagnetic energy toward the plasma. In someembodiments, the method involves directing a portion of the highbrightness light toward the reflective surface of the chamber which isreflected toward the reflector and, electromagnetic energy comprisingthe second set of predefined wavelengths of electromagnetic energypasses through the reflector.

The method can involve directing the laser energy through an opticalelement that modifies a property of the laser energy to direct the laserenergy toward the plasma over a large solid angle. In some embodiments,the method involves directing the laser energy through an opticalelement that modifies a property of the laser energy to direct the laserenergy toward the plasma over a solid angle of approximately 0.012steradians. In some embodiments, the method involves directing the laserenergy through an optical element that modifies a property of the laserenergy to direct the laser energy toward the plasma over a solid angleof approximately 0.048 steradians. In some embodiments, the methodinvolves directing the laser energy through an optical element thatmodifies a property of the laser energy to direct the laser energytoward the plasma over a solid angle of greater than about 2π (about6.28) steradians. In some embodiments, the reflective surface of thechamber is adapted to provide the laser energy to the plasma over alarge solid angle. In some embodiments, the reflective surface of thechamber is adapted to collect the high brightness light generated by theplasma over a large solid angle.

The invention, in another aspect, relates to a method for producinglight. The method involves ionizing with an ignition source a gas withina chamber that has a reflective surface. The method also involvesdirecting electromagnetic energy from a laser toward a reflector that atleast substantially reflects a first set of wavelengths ofelectromagnetic energy toward the ionized gas in the chamber to producea plasma that generates a high brightness light.

In some embodiments, the electromagnetic energy from the laser first isreflected by the reflector toward the reflective surface of the chamber.In some embodiments, the electromagnetic energy directed toward thereflective surface of the chamber is reflected toward the plasma. Insome embodiments, a portion of the high brightness light is directedtoward the reflective surface of the chamber, reflected toward thereflector and passes through the reflector.

In some embodiments, the electromagnetic energy from the laser firstpasses through the reflector and travels toward the reflective surfaceof the chamber. In some embodiments, the electromagnetic energy directedtoward the reflective surface of the chamber is reflected toward theplasma. In some embodiments, a portion of the high brightness light isdirected toward the reflective surface of the chamber, reflected towardthe reflector and reflected by the reflector.

The invention, in another aspect, features a light source that includesa chamber having a reflective surface. The light source also includes ameans for ionizing a gas within the chamber. The light source alsoincludes a means for at least substantially reflecting a first set ofpredefined wavelengths of electromagnetic energy directed toward thereflector and at least substantially allowing a second set of predefinedwavelengths of electromagnetic energy to pass through the reflector. Thelight source also includes a means for providing electromagnetic energyto the ionized gas within the chamber to produce a plasma that generatesa high brightness light.

The invention, in another aspect, features a light source that includesa sealed chamber. The light source also includes an ignition source forionizing a gas within the chamber. The light source also includes atleast one laser external to the sealed chamber for providingelectromagnetic energy to the ionized gas within the chamber to producea plasma that generates a high brightness light. The light source alsoincludes a curved reflective surface disposed external to the sealedchamber to receive at leas a portion of the high brightness lightemitted by the sealed chamber and reflect the high brightness lighttoward an output of the light source.

In some embodiments, the light source includes an optical elementdisposed along a path the electromagnetic energy from the laser travels.In some embodiments, the sealed chamber includes a support element thatlocates the sealed chamber relative to the curved reflective surface. Insome embodiments, the sealed chamber is a quartz bulb. In someembodiments, the light source includes a second curved reflectivesurface disposed internal or external to the sealed chamber to receiveat least a portion of the laser electromagnetic energy and focus theelectromagnetic energy on the plasma that generates the high brightnesslight.

The invention, in another aspect, features a light source that includesa sealed chamber and an ignition source for ionizing a gas within thechamber. The light source also includes at least one laser external tothe sealed chamber for providing electromagnetic energy. The lightsource also includes a curved reflective surface to receive and reflectat least a portion of the electromagnetic energy toward the ionized gaswithin the chamber to produce a plasma that generates a high brightnesslight, the curved reflective surface also receives at least a portion ofthe high brightness light emitted by the plasma and reflects the highbrightness light toward an output of the light source.

In some embodiments, the curved reflective surface focuses theelectromagnetic energy on a region in the chamber where the plasma islocated. In some embodiments, the curved reflective surface is locatedwithin the chamber. In some embodiments, the curved reflective surfaceis located external to the chamber. In some embodiments, the highbrightness light is ultraviolet light, includes ultraviolet light or issubstantially ultraviolet light.

The invention, in another aspect, features a light source that includesa chamber. The light source also includes an energy source for providingenergy to a gas within the chamber to produce a plasma that generates alight emitted through the walls of the chamber. The light source alsoincludes a reflector that reflects the light emitted through the wallsof the chamber. The reflector includes a reflective surface with a shapeconfigured to compensate for the refractive index of the walls of thechamber. The shape can include a modified parabolic, elliptical,spherical, or aspherical shape.

In some embodiments, the energy source is at least one laser external tothe chamber. In some embodiments, the energy source is also an ignitionsource within the chamber. The energy source can be a microwave energysource, an AC arc source, a DC arc source, a laser, or an RF energysource. The energy source can be a pulse laser, a continuous-wave fiberlaser, or a diode laser.

In some embodiments, the chamber is a sealed chamber. The chamber caninclude a cylindrical tube. In some embodiments, the cylindrical tube istapered. The chamber can include one or more seals at one or both endsof the cylindrical tube. The chamber can include sapphire, quartz, fusedquartz, Suprasil quartz, fused silica, Suprasil fused silica, MgF₂,diamond, single crystal quartz, or CaF₂. The chamber can include adielectric material. The chamber can include an ultraviolet transparentdielectric material. The chamber can protrude through an opening in thereflector.

In some embodiments, the light source also includes an ignition sourcefor ionizing the gas within the chamber. The ignition source can includeelectrodes, an ultraviolet ignition source, a capacitive ignitionsource, an inductive ignition source, a flash lamp, a pulsed laser, or apulsed lamp. The ignition source can include electrodes located onopposite sides of the plasma.

In some embodiments, the light source also includes a support elementthat locates the chamber relative to the reflector. The support elementcan include a fitting to allow at least one of pressure control orfilling of the chamber.

In some embodiments, the light source includes at least one opticalelement. The optical element can modify a property of the light emittedthrough the walls of the chamber and reflected by the reflector. Theoptical element can be a mirror or a lens. The optical element can beconfigured to deliver the light emitted through the walls of the chamberand reflected by the reflector to a tool (e.g. a wafer inspection tool,a microscope, an ultraviolet microscope, a reticle inspection system, ametrology tool, a lithography tool, or an endoscopic tool).

The invention, in another aspect, features a method for producing light.The method involves emitting a light through the walls of a chamber. Themethod also involves using a reflective surface of a reflector toreflect the light, wherein the reflective surface has a shape configuredto compensate for the refractive index of the walls of the chamber.

In some embodiments, the method also involves flowing gas into thechamber. In some embodiments, the method also involves igniting the gasin the chamber to produce an ionized gas. In some embodiments, themethod also involves directing energy to the ionized gas to produce aplasma that generates a light (e.g. a high brightness light). In someembodiments, the method also involves directing laser energy into thechamber from at least one laser external to the chamber. In someembodiments, the method also involves directing the laser energy throughan optical element that modifies a property of the laser energy. In someembodiments, the method also involves directing the reflected lightthrough an optical element to modify a property of the reflected light.In some embodiments, the method also involves directing the reflectedlight to a tool. In some embodiments, the method also involvescontrolling the pressure of the chamber.

In some embodiments, the method also involves expressing the shape as amathematical equation. In some embodiments, the method also involvesselecting parameters of the equation to reduce error due to therefractive index of the walls of the chamber below a specified value. Insome embodiments, the method also involves configuring the shape tocompensate for the refractive index of the walls of the chamber. In someembodiments, the method also involves producing a collimated or focusedbeam of reflected light with the reflective surface. In someembodiments, the method also involves modifying a parabolic, elliptical,spherical, or aspherical shape to compensate for the refractive index ofthe walls of the chamber to produce a focused, reflected high brightnesslight.

The invention, in another aspect, features a light source including achamber. The light source also includes a laser source for providingelectromagnetic energy to a gas within the chamber to produce a plasmathat generates a light emitted through the walls of the chamber. Thelight source also includes a reflector that reflects the electromagneticenergy through the walls of the chamber and the light emitted throughthe walls of the chamber, the reflector includes a reflective surfacewith a shape configured to compensate for the refractive index of thewalls of the chamber.

The invention, in another aspect, features a light source having achamber. The light source also includes means for providing energy to agas within the chamber to produce a plasma that generates a lightemitted through the walls of the chamber. The light source also includesmeans for reflecting the light emitted through the walls of the chamber,the reflecting means including a reflective surface with a shapeconfigured to compensate for the refractive index of the walls of thechamber.

The invention, in another aspect, features a light source having achamber. The light source also includes an ignition source for ionizinga medium (e.g., a gas) within the chamber. The light source alsoincludes a laser for providing energy to the ionized medium within thechamber to produce a light. The light source also includes a blockersuspended along a path the energy travels to block at least a portion ofthe energy.

In some embodiments, the blocker deflects energy provided to the ionizedmedium that is not absorbed by the ionized medium away from an output ofthe light source. In some embodiments, the blocker is a mirror.

In some embodiments, the blocker absorbs the energy provided to theionized medium that is not absorbed by the ionized medium. The blockercan include graphite.

In some embodiments, the blocker reflects energy provided to the ionizedmedium that is not absorbed by the ionized medium. In some embodiments,the reflected energy is reflected toward the ionized medium in thechamber. In some embodiments, the blocker is a coating on a portion ofthe chamber.

In some embodiments, the light source includes a coolant channeldisposed in the blocker. In some embodiments, the light source includesa coolant supply (e.g., for supplying coolant, for example, water)coupled to the coolant channel. In some embodiments, light sourceincludes a gas source that blows a gas (e.g., nitrogen or air) on theblocker to cool the blocker.

In some embodiments, the light source includes an arm connecting theblocker to a housing of the light source.

In some embodiments, the energy provided by the laser enters the chamberon a first side of the chamber and the blocker is suspended on a secondside of the chamber opposite the first side.

The invention, in another aspect, relates to a method for producinglight. The method involves ionizing with an ignition source a mediumwithin a chamber. The method also involves providing laser energy to theionized medium in the chamber to produce a light. The method alsoinvolves blocking energy provided to the ionized medium that is notabsorbed by the ionized medium with a blocker suspended along a path theenergy travels.

In some embodiments, blocking the energy involves deflecting the energyaway from an output of the light source. In some embodiments, theblocker includes a mirror. In some embodiments, blocking the energyincludes absorbing the energy. In some embodiments, blocking the energyincludes reflecting the energy. In some embodiments, reflecting theenergy includes reflecting the energy towards the ionized medium in thechamber.

In some embodiments, the method also involves cooling the blocker. Insome embodiments, cooling the blocker includes flowing a coolant througha channel in or coupled to the blocker. In some embodiments, the methodinvolves blowing a gas on the blocker to cooler the blocker.

The invention, in another aspect, relates to a method for producinglight. The method involves ionizing with an ignition source a gas withina chamber. The method also involves providing laser energy to theionized gas in the chamber at a pressure of greater than 10 atmospheresto produce a high brightness light.

In some embodiments, the gas within the chamber is at a pressure ofgreater than 30 atmospheres. In some embodiments, the gas within thechamber is at a pressure of greater than 50 atmospheres. In someembodiments, the high brightness light is emitted from a plasma having avolume of about 0.01 mm³.

The invention, in another aspect, relates to a light source having achamber with a gas disposed therein, and ignition source and at leastone laser. The ignition source excites the gas. The excited gas has atleast one strong absorption line at an infrared wavelength. The at leastone laser provides energy to the excited gas at a wavelength near astrong absorption line of the excited gas within the chamber to producea high brightness light.

In some embodiments, the gas comprises a noble gas. The gas can comprisexenon. In some embodiments, the excited gas comprises atoms at a lowestexcited state. The gas can be absorptive near the wavelength of the atleast one laser. The strong absorption line of the excited gas can beabout 980 nm or about 882 nm. In some embodiments, the excited gas is ina metastable state.

The invention, in another aspect, relates to a method for producinglight. An ignition source excites a gas within a chamber. A laser istuned to a first wavelength to provide energy to the excited gas in thechamber to produce a high brightness light. The excited gas absorbsenergy near the first wavelength. The laser is tuned to a secondwavelength to provide energy to the excited gas in the chamber tomaintain the high brightness light. The excited gas absorbs energy nearthe second wavelength.

In some embodiments, the laser is tuned to the first and secondwavelengths by adjusting the operating temperature of the laser. In someembodiments, the laser is a diode laser and the laser is tunedapproximately 0.4 nm per degree Celsius of temperature adjustment. Theoperating temperature of the laser can be adjusted by varying a currentof a thermoelectric cooling device.

The gas within the chamber can have atoms with electrons in at least oneexcited atomic state. The gas within chamber can be a noble gas, and insome embodiments, the gas within the chamber is xenon.

In some embodiments, the first wavelength is approximately 980 nm. Thesecond wavelength can be approximately 975 nm. The second wavelength canbe approximately 1 nm to approximately 10 nm displaced from the firstwavelength. The invention, in another aspect, relates to a light source.The light source includes a chamber having one or more walls and a gasdisposed within the chamber. The light source also includes at least onelaser for providing a converging beam of energy focused on the gaswithin the chamber to produce a plasma that generates a light emittedthrough the walls of the chamber, such that a numerical aperture of theconverging beam of energy is between about 0.1 to about 0.8. In someembodiments, the numerical aperture is about 0.4 to about 0.6. Thenumeral aperture can be about 0.5.

The light source can also include an optical element within a path ofthe beam. The optical element can be capable of increasing the numericalaperture of the beam. In some embodiments, the optical element is a lensor a mirror. The lens can be an aspheric lens. In some embodiments, aspectral radiance of the plasma increases with an increase in numericalaperture of the beam.

The invention, in another aspect, relates to a method of pre-aligning abulb for a light source. The bulb, having two electrodes, is coupled toa mounting base. The bulb and mounting base structure are inserting intoa camera assembly. The camera assembly includes at least one camera anda display screen. At least one image of the bulb from the at least onecamera is displays on the display screen. A position of the bulb withinthe mounted base is adjusted such that a region of the bulb between thetwo electrodes aligns with a positioning grid on the display screen.

In some embodiments, a lamp for a light source is pre-aligned using themethod described herein.

In some embodiments, the method also includes toggling between the atleast two cameras to align the bulb. The camera assembly can include twocameras. Images from the two cameras can be displayed in differentcolors. In some embodiments, the two cameras are positioned to captureimages of the bulb from two orthogonal directions.

The position of the bulb can be adjusted vertically and horizontally.The position of the bulb can be adjusted by a manipulator. Themanipulator can be positioned above the bulb and can be capable ofmoving the bulb vertically and horizontally.

The method can also include securing the bulb to a base after the regionof the bulb between the two electrodes aligns with the positioning gridon the display screen. In some embodiments, the positioning grid ispre-determined such that when the center area of the bulb between thetwo electrodes aligns with the positioning grid on the display screen,the region is aligned relative to a focal point of a laser when the bulband mounting base are inserted into a light source.

The invention, in another aspect, relates to a method for decreasingnoise within a light source. The light source includes a laser. A sampleof light emitted from the light source is collected. The sample of lightis converted to an electrical signal. The electrical is compared to areference signal to obtain an error signal. The error signal isprocessed to obtain a control signal. A magnitude of a laser of thelight source is set based on the control signal to decrease noise withinthe light source. These steps can be repeated until a desired amount ofnoise is reached.

In some embodiments, the sample of light emitted from the light sourceis collected from a beam splitter. The beam splitter can be a glass beamsplitter or a bifurcated fiber bundle.

In some embodiments, the error signal is the difference between thereference sample and the converted sample. The error signal can beprocessed by a control amplifier. The control amplifier is capable ofoutputting a control signal proportional to at least one of a timeintegral, a time derivative, or a magnitude of the error signal.

The sample can be collected using a photodiode. In some embodiments, thesample is collected using a photodiode within a casing of the lightsource. In some embodiments, the sample is collected using a photodiodeexternal to a casing of the light source. In some embodiments, twosamples are collected. One sample can be collected using a firstphotodiode within a casing of the light source and another sample can becollected using a second photodiode external to the casing of the lightsource.

The invention, in another aspect, relates to a light source. The lightsource includes a chamber having one or more walls and a gas disposedwithin the chamber. The light source also includes at least one laserfor providing energy to the gas within the chamber to produce a plasmathat generates a light emitted through the walls of the chamber. Adichroic mirror is positioned within a path of the at least one lasersuch that the laser energy is directed toward the plasma. The dichroicmirror selectively reflects at least one wavelength of light such thatthe light generated by the plasma is not substantially reflected towardthe at least one laser.

The invention, in another aspect, relates to a light source. The lightsource has a chamber with a gas disposed therein and an ignition sourcefor exciting the gas. The light source also has at least one laser forproviding energy to the excited gas within the chamber to produce a highbrightness light having a first spectrum. An optical element is disposedwithin the path of the high brightness light to modify the firstspectrum of the high brightness light to a second spectrum.

The optical element can be a prism, a weak lens, a strong lens, or adichroic filter. In some embodiments, the second spectrum has a greaterproportion of intensity of light in the ultraviolet range than the firstspectrum. In some embodiments, the first spectrum has a greaterproportion of intensity of light in the visible range than the secondspectrum.

The invention, in another aspect, relates to a method for decreasingnoise of a light source within a predetermined frequency band. The lightsource includes a laser diode. A current of the laser diode is modulatedat a frequency greater than the predetermined frequency band causing thelaser to rapidly switch between different sets of modes to decreasenoise of the light source within the predetermined frequency band.

The foregoing and other objects, aspects, features, and advantages ofthe invention will become more apparent from the following descriptionand from the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other objects, feature and advantages of theinvention, as well as the invention itself, will be more fullyunderstood from the following illustrative description, when readtogether with the accompanying drawings which are not necessarily toscale.

FIG. 1 is a schematic block diagram of a light source, according to anillustrative embodiment of the invention.

FIG. 2 is a schematic block diagram of a portion of a light source,according to an illustrative embodiment of the invention.

FIG. 3 is a graphical representation of UV brightness as a function ofthe laser power provided to a plasma, using a light source according tothe invention.

FIG. 4 is a graphical representation of the transmission of laser energythrough a plasma generated from mercury, using a light source accordingto the invention.

FIG. 5 is a schematic block diagram of a light source, according to anillustrative embodiment of the invention.

FIG. 6 is a schematic block diagram of a light source, according to anillustrative embodiment of the invention.

FIG. 7 is a schematic block diagram of a light source, according to anillustrative embodiment of the invention.

FIG. 8A is a schematic block diagram of a light source in whichelectromagnetic energy from a laser is provided to a plasma over a firstsolid angle, according to an illustrative embodiment of the invention.

FIG. 8B is a schematic block diagram of the light source of FIG. 8A inwhich the electromagnetic energy from the laser is provided to theplasma over a larger solid angle, according to an illustrativeembodiment of the invention.

FIG. 9 is a schematic diagram of a light source in which the reflectivesurface does not compensate for the refractive index of the chambercontaining a plasma.

FIG. 10A is a schematic diagram of a light source with a chamber and areflector that reflects light produced in the chamber according, to anillustrative embodiment of the invention.

FIG. 10B is a schematic diagram of a light source with a chamber and areflector that reflects light produced in the chamber according, to anillustrative embodiment of the invention.

FIG. 11 is a schematic diagram of a light source including a chamber anda reflector that reflects light produced in the chamber, according to anillustrative embodiment of the invention.

FIG. 12 is a cross-sectional view of a light source, according to anillustrative embodiment of the invention.

FIG. 13 is a graphical representation of the radii by which light raysreflected off of the reflective surface miss the remote focus point fordifferent mathematical fit orders for a mathematical equation thatexpresses the shape of the reflective surface.

FIG. 14 is a schematic block diagram of a light source, according to anillustrative embodiment of the invention.

FIG. 15A is a cross-sectional view of a light source, according to anillustrative embodiment of the invention.

FIG. 15B is an end face view of the light source of FIG. 15A.

FIG. 16 is a graphical representation of brightness as a function of thepressure in a chamber of a light source, using a light source accordingto the invention.

FIG. 17 is an energy level diagram of atomic and molecular xenon.

FIG. 18 is a graphical representation of transition energies of firstabsorptions and energy levels of rare gas atoms.

FIG. 19 is a graph depicting laser output wavelength versus temperaturefor a tuning mechanism, according to an illustrative embodiment of theinvention.

FIG. 20 is a graph depicting power versus pressure for xenon and argon.

FIG. 21 is a schematic illustration of converging laser beam numericalapertures, according to an illustrative embodiment of the invention.

FIG. 22 is a graph of spectral radiance versus numerical aperture,according to an illustrative embodiment of the invention.

FIG. 23A is a side view of a chamber within a bulb assembly, accordingto an illustrative embodiment of the invention.

FIG. 23B is a side view of a bulb assemble with a mounting base,according to an illustrative embodiment of the invention.

FIG. 24 is a schematic illustration of a camera assembly, according toan illustrative embodiment of the invention.

FIG. 25 is a schematic illustration of a display screen with analignment feature, according to an illustrative embodiment of theinvention.

FIG. 26 is a flow chart of a method of pre-aligning a bulb for a lightsource, according to an illustrative embodiment of the invention.

FIG. 27 is a schematic illustration of a feedback loop, according to anillustrative embodiment of the invention.

FIG. 28 is a schematic illustration of a control system block diagram ofa feedback loop, according to an illustrative embodiment of theinvention.

FIG. 29 is a schematic illustration of an optical setup for alaser-drive light source noise measurement system, according to anillustrative embodiment of the invention.

FIG. 30 is a schematic illustration of a weak lens feedback method,according to an illustrative embodiment of the invention.

FIG. 31 is a schematic illustration of a strong lens feedback method,according to an illustrative embodiment of the invention.

FIG. 32 is a schematic illustration of a filter feedback method,according to an illustrative embodiment of the invention.

FIG. 33 is a schematic illustration of a prism feedback method,according to an illustrative embodiment of the invention.

FIG. 34 is a schematic illustration of a selectively reflective mirror,according to an illustrative embodiment of the invention.

FIG. 35 is a schematic illustration of a laser-driven light source in anabsorption cell, according to an illustrative embodiment of theinvention.

FIG. 36 is a schematic illustration of a laser-driven light source in aultra-violet (“UV”) light detector, according to an illustrativeembodiment of the invention.

FIG. 37 is a schematic illustration of a laser-driven light source in adiode array detector, according to an illustrative embodiment of theinvention.

FIG. 38 is a schematic illustration of a laser-driven light source in afluorescence detector, according to an illustrative embodiment of theinvention.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

FIG. 1 is a schematic block diagram of a light source 100 for generatinglight that embodies the invention. The light source 100 includes achamber 128 that contains an ionizable medium (not shown). The lightsource 100 provides energy to a region 130 of the chamber 128 having theionizable medium which creates a plasma 132. The plasma 132 generatesand emits a high brightness light 136 that originates from the plasma132. The light source 100 also includes at least one laser source 104that generates a laser beam that is provided to the plasma 132 locatedin the chamber 128 to initiate and/or sustain the high brightness light136.

In some embodiments, it is desirable for at least one wavelength ofelectromagnetic energy generated by the laser source 104 to be stronglyabsorbed by the ionizable medium in order to maximize the efficiency ofthe transfer of energy from the laser source 104 to the ionizablemedium.

In some embodiments, it is desirable for the plasma 132 to be small insize in order to achieve a high brightness light source. Brightness isthe power radiated by a source of light per unit surface area into aunit solid angle. The brightness of the light produced by a light sourcedetermines the ability of a system (e.g., a metrology tool) or anoperator to see or measure things (e.g., features on the surface of awafer) with adequate resolution. It is also desirable for the lasersource 104 to drive and/or sustain the plasma with a high power laserbeam.

Generating a plasma 132 that is small in size and providing the plasma132 with a high power laser beam leads simultaneously to a highbrightness light 136. The light source 100 produces a high brightnesslight 136 because most of the power introduced by the laser source 104is then radiated from a small volume, high temperature plasma 132. Theplasma 132 temperature will rise due to heating by the laser beam untilbalanced by radiation and other processes. The high temperatures thatare achieved in the laser sustained plasma 132 yield increased radiationat shorter wavelengths of electromagnetic energy, for example,ultraviolet energy. In one experiment, temperatures between about 10,000K and about 20,000 K have been observed. The radiation of the plasma132, in a general sense, is distributed over the electromagneticspectrum according to Planck's radiation law. The wavelength of maximumradiation is inversely proportional to the temperature of a black bodyaccording to Wien's displacement law. While the laser sustained plasmais not a black body, it behaves similarly and as such, the highestbrightness in the ultraviolet range at around 300 nm wavelength isexpected for laser sustained plasmas having a temperature of betweenabout 10,000 K and about 15,000 K. Most conventional arc lamps are,however, unable to operate at these temperatures.

It is therefore desirable in some embodiments of the invention tomaintain the temperature of the plasma 132 during operation of the lightsource 100 to ensure that a sufficiently bright light 136 is generatedand that the light emitted is substantially continuous during operation.

In this embodiment, the laser source 104 is a diode laser that outputs alaser beam via a fiberoptic element 108. The fiber optic element 108provides the laser beam to a collimator 112 that aids in conditioningthe output of the diode laser by aiding in making laser beam rays 116substantially parallel to each other. The collimator 112 then directsthe laser beam 116 to a beam expander 118. The beam expander 118 expandsthe size of the laser beam 116 to produce laser beam 122. The beamexpander 118 also directs the laser beam 122 to an optical lens 120. Theoptical lens 120 is configured to focus the laser beam 122 to produce asmaller diameter laser beam 124 that is directed to the region 130 ofthe chamber 128 where the plasma 132 exists (or where it is desirablefor the plasma 132 to be generated and sustained).

In this embodiment, the light source 100 also includes an ignitionsource 140 depicted as two electrodes (e.g., an anode and cathodelocated in the chamber 128). The ignition source 140 generates anelectrical discharge in the chamber 128 (e.g., the region 130 of thechamber 128) to ignite the ionizable medium. The laser then provideslaser energy to the ionized medium to sustain or create the plasma 132which generates the high brightness light 136. The light 136 generatedby the light source 100 is then directed out of the chamber to, forexample, a wafer inspection system (not shown).

Alternative laser sources are contemplated according to illustrativeembodiments of the invention. In some embodiments, neither thecollimator 112, the beam expander 118, or the lens 120 may be required.In some embodiments, additional or alternative optical elements can beused. The laser source can be, for example, an infrared (IR) lasersource, a diode laser source, a fiber laser source, an ytterbium lasersource, a CO₂ laser source, a YAG laser source, or a gas discharge lasersource. In some embodiments, the laser source 104 is a pulse lasersource (e.g., a high pulse rate laser source) or a continuous wave lasersource. Fiber lasers use laser diodes to pump a special doped fiberwhich then lases to produce the output (i.e., a laser beam). In someembodiments, multiple lasers (e.g., diode lasers) are coupled to one ormore fiber optic elements (e.g., the fiber optic element 108). Diodelasers take light from one (or usually many) diodes and direct the lightdown a fiber to the output. In some embodiments, fiber laser sources anddirect semiconductor laser sources are desirable for use as the lasersource 104 because they are relatively low in cost, have a small formfactor or package size, and are relatively high in efficiency.

Efficient, cost effective, high power lasers (e.g., fiber lasers anddirect diode lasers) are recently available in the NIR (near infrared)wavelength range from about 700 nm to about 2000 nm. Energy in thiswavelength range is more easily transmitted through certain materials(e.g., glass, quartz and sapphire) that are more commonly used tomanufacture bulbs, windows and chambers. It is therefore more practicalnow to produce light sources that operate using lasers in the 700 nm to2000 nm range than has previously been possible.

In some embodiments, the laser source 104 is a high pulse rate lasersource that provides substantially continuous laser energy to the lightsource 100 sufficient to produce the high brightness light 136. In someembodiments, the emitted high brightness light 136 is substantiallycontinuous where, for example, magnitude (e.g. brightness or power) ofthe high brightness light does not vary by more than about 90% duringoperation. In some embodiments, the ratio of the peak power of the laserenergy delivered to the plasma to the average power of the laser energydelivered to the plasma is approximately 2-3. In some embodiments, thesubstantially continuous energy provided to the plasma 132 is sufficientto minimize cooling of the ionized medium to maintain a desirablebrightness of the emitted light 136.

In this embodiment, the light source 100 includes a plurality of opticalelements (e.g., a beam expander 118, a lens 120, and fiber optic element108) to modify properties (e.g., diameter and orientation) of the laserbeam delivered to the chamber 132. Various properties of the laser beamcan be modified with one or more optical elements (e.g., mirrors orlenses). For example, one or more optical elements can be used to modifythe portions of, or the entire laser beam diameter, direction,divergence, convergence, numerical aperture and orientation. In someembodiments, optical elements modify the wavelength of the laser beamand/or filter out certain wavelengths of electromagnetic energy in thelaser beam.

Lenses that can be used in various embodiments of the invention include,aplanatic lenses, achromatic lenses, single element lenses, and fresnellenses. Minors that can be used in various embodiments of the inventioninclude, coated mirrors, dielectric coated mirrors, narrow band mirrors,and ultraviolet transparent infrared reflecting mirrors. By way ofexample, ultraviolet transparent infrared reflecting mirrors are used insome embodiments of the invention where it is desirable to filter outinfrared energy from a laser beam while permitting ultraviolet energy topass through the mirror to be delivered to a tool (e.g., a waferinspection tool, a microscope, a lithography tool or an endoscopictool).

In this embodiment, the chamber 128 is a sealed chamber initiallycontaining the ionizable medium (e.g., a solid, liquid or gas). In someembodiments, the chamber 128 is instead capable of being actively pumpedwhere one or more gases are introduced into the chamber 128 through agas inlet (not shown), and gas is capable of exiting the chamber 128through a gas outlet (not shown). The chamber can be fabricated from orinclude one or more of, for example, a dielectric material, a quartzmaterial, Suprasil quartz, sapphire, MgF₂, diamond or CaF₂. The type ofmaterial may be selected based on, for example, the type of ionizablemedium used and/or the wavelengths of light 136 that are desired to begenerated and output from the chamber 128. In some embodiments, a regionof the chamber 128 is transparent to, for example, ultraviolet energy.Chambers 128 fabricated using quartz will generally allow wavelengths ofelectromagnetic energy of as long as about 2 microns to pass throughwalls of the chamber. Sapphire chamber walls generally allowelectromagnetic energy of as long as about 4 microns to pass through thewalls.

In some embodiments, it is desirable for the chamber 128 to be a sealedchamber capable of sustaining high pressures and temperatures. Forexample, in one embodiment, the ionizable medium is mercury vapor. Tocontain the mercury vapor during operation, the chamber 128 is a sealedquartz bulb capable of sustaining pressures between about 10 to about200 atmospheres and operating at about 900 degrees centigrade. Thequartz bulb also allows for transmission of the ultraviolet light 136generated by the plasma 132 of the light source 100 through the chamber128 walls.

Various ionizable media can be used in alternative embodiments of theinvention. For example, the ionizable medium can be one or more of anoble gas, Xe, Ar, Ne, Kr, He, D₂, H₂, O₂, F₂, a metal halide, ahalogen, Hg, Cd, Zn, Sn, Ga, Fe, Li, Na, an excimer forming gas, air, avapor, a metal oxide, an aerosol, a flowing media, or a recycled media.In some embodiments, a solid or liquid target (not shown) in the chamber128 is used to generate an ionizable gas in the chamber 128. The lasersource 104 (or an alternative laser source) can be used to provideenergy to the target to generate the ionizable gas. The target can be,for example, a pool or film of metal. In some embodiments, the target isa solid or liquid that moves in the chamber (e.g., in the form ofdroplets of a liquid that travel through the region 130 of the chamber128). In some embodiments, a first ionizable gas is first introducedinto the chamber 128 to ignite the plasma 132 and then a separate secondionizable gas is introduced to sustain the plasma 132. In thisembodiment, the first ionizable gas is a gas that is more easily ignitedusing the ignition source 140 and the second ionizable gas is a gas thatproduces a particular wavelength of electromagnetic energy.

In this embodiment, the ignition source 140 is a pair of electrodeslocated in the chamber 128. In some embodiments, the electrodes arelocated on the same side of the chamber 128. A single electrode can beused with, for example, an RF ignition source or a microwave ignitionsource. In some embodiments, the electrodes available in a conventionalarc lamp bulb are the ignition source (e.g., a model USH-200DP quartzbulb manufactured by Ushio (with offices in Cypress, Calif.)). In someembodiments, the electrodes are smaller and/or spaced further apart thanthe electrodes used in a conventional arc lamp bulb because theelectrodes are not required for sustaining the high brightness plasma inthe chamber 128.

Various types and configurations of ignition sources are alsocontemplated, however, that are within the scope of the presentinvention. In some embodiments, the ignition source 140 is external tothe chamber 128 or partially internal and partially external to thechamber 128. Alternative types of ignition sources 140 that can be usedin the light source 100 include ultraviolet ignition sources, capacitivedischarge ignition sources, inductive ignition sources, RF ignitionsources, a microwave ignition sources, flash lamps, pulsed lasers, andpulsed lamps. In one embodiment, no ignition source 140 is required andinstead the laser source 104 is used to ignite the ionizable medium andto generate the plasma 132 and to sustain the plasma and the highbrightness light 136 emitted by the plasma 132.

In some embodiments, it is desirable to maintain the temperature of thechamber 128 and the contents of the chamber 128 during operation of thelight source 100 to ensure that the pressure of gas or vapor within thechamber 128 is maintained at a desired level. In some embodiments, theignition source 140 can be operated during operation of the light source100, where the ignition source 140 provides energy to the plasma 132 inaddition to the energy provided by the laser source 104. In this manner,the ignition source 140 is used to maintain (or maintain at an adequatelevel) the temperature of the chamber 128 and the contents of thechamber 128.

In some embodiments, the light source 100 includes at least one opticalelement (e.g., at least one mirror or lens) for modifying a property ofthe electromagnetic energy (e.g., the high brightness light 136) emittedby the plasma 132 (e.g., an ionized gas), similarly as describedelsewhere herein.

FIG. 2 is a schematic block diagram of a portion of a light source 200incorporating principles of the present invention. The light source 200includes a chamber 128 containing an ionizable gas and has a window 204that maintains a pressure within the chamber 128 while also allowingelectromagnetic energy to enter the chamber 128 and exit the chamber128. In this embodiment, the chamber 128 has an ignition source (notshown) that ignites the ionizable gas (e.g., mercury or xenon) toproduce a plasma 132.

A laser source 104 (not shown) provides a laser beam 216 that isdirected through a lens 208 to produce laser beam 220. The lens 208focuses the laser beam 220 on to a surface 224 of a thin film reflector212 that reflects the laser beam 220 to produce laser beam 124. Thereflector 212 directs the laser beam 124 on region 130 where the plasma132 is located. The laser beam 124 provides energy to the plasma 132 tosustain and/or generate a high brightness light 136 that is emitted fromthe plasma 132 in the region 130 of the chamber 128.

In this embodiment, the chamber 128 has a paraboloid shape and an innersurface 228 that is reflective. The paraboloid shape and the reflectivesurface cooperate to reflect a substantial amount of the high brightnesslight 136 toward and out of the window 204. In this embodiment, thereflector 212 is transparent to the emitted light 136 (e.g., at leastone or more wavelengths of ultraviolet light). In this manner, theemitted light 136 is transmitted out of the chamber 128 and directed to,for example, a metrology tool (not shown). In one embodiment, theemitted light 136 is first directed towards or through additionaloptical elements before it is directed to a tool.

By way of illustration, an experiment was conducted to generateultraviolet light using a light source, according to an illustrativeembodiment of the invention. A model L6724 quartz bulb manufactured byHamamatsu (with offices in Bridgewater, N.J.) was used as the chamber ofthe light source (e.g., the chamber 128 of the light source 100 ofFIG. 1) for experiments using xenon as the ionizable medium in thechamber. A model USH-200DP quartz bulb manufactured by Ushio (withoffices in Cypress, Calif.) was used as the chamber of the light sourcefor experiments using mercury as the ionizable medium in the chamber.FIG. 3 illustrates a plot 300 of the UV brightness of a high brightnesslight produced by a plasma located in the chamber as a function of thelaser power (in watts) provided to the plasma. The laser source used inthe experiment was a 1.09 micron, 100 watt CW laser. The Y-Axis 312 ofthe plot 300 is the UV brightness (between about 200 and about 400 nm)in watts/mm² steradian (sr). The X-Axis 316 of the plot 300 is the laserbeam power in watts provided to the plasma. Curve 304 is the UVbrightness of the high brightness light produced by a plasma that wasgenerated using xenon as the ionizable medium in the chamber. The plasmain the experiment using xenon was between about 1 mm and about 2 mm inlength and about 0.1 mm in diameter. The length of the plasma wascontrolled by adjusting the angle of convergence of the laser beam. Alarger angle (i.e., larger numerical aperture) leads to a shorter plasmabecause the converging beam reaches an intensity capable of sustainingthe plasma when it is closer to the focal point. Curve 308 is the UVbrightness of the high brightness light produced by a plasma that wasgenerated using mercury as the ionizable medium in the chamber. Theplasma in the experiment using mercury was about 1 mm in length andabout 0.1 mm in diameter.

By way of illustration, another experiment was conducted to generateultraviolet using a light source according to an illustrative embodimentof the invention. A model USH-200DP quartz bulb manufactured by Ushio(with offices in Cypress, Calif.) was used as the chamber of the lightsource for experiments using mercury as the ionizable medium in thechamber (e.g., the chamber 128 of the light source 100 of FIG. 1). Thelaser source used in the experiment was a 1.09 micron, 100 wattytterbium doped fiber laser from SPI Lasers PLC (with offices in LosGatos, Calif.). FIG. 4 illustrates a plot 400 of the transmission oflaser energy through a plasma located in the chamber generated frommercury versus the amount of power provided to the plasma in watts. TheY-Axis 412 of the plot 400 is the transmission coefficient innon-dimensional units. The X-Axis 416 of the plot 400 is the laser beampower in watts provided to the plasma. The curve in the plot 400illustrates absorption lengths of 1 mm were achieved using the lasersource. The transmission value of 0.34 observed at 100 watts correspondsto a 1/e absorption length of about 1 mm.

FIG. 5 is a schematic block diagram of a portion of a light source 500incorporating principles of the present invention. The light source 500includes a chamber 528 that has a reflective surface 540. The reflectivesurface 540 can have, for example, a parabolic shape, elliptical shape,curved shape, spherical shape or aspherical shape. In this embodiment,the light source 500 has an ignition source (not shown) that ignites anionizable gas (e.g., mercury or xenon) in a region 530 within thechamber 528 to produce a plasma 532.

In some embodiments, the reflective surface 540 can be a reflectiveinner or outer surface. In some embodiments, a coating or film islocated on the inside or outside of the chamber to produce thereflective surface 540.

A laser source (not shown) provides a laser beam 516 that is directedtoward a surface 524 of a reflector 512. The reflector 512 reflects thelaser beam 520 toward the reflective surface 540 of the chamber 528. Thereflective surface 540 reflects the laser beam 520 and directs the laserbeam toward the plasma 532. The laser beam 516 provides energy to theplasma 532 to sustain and/or generate a high brightness light 536 thatis emitted from the plasma 532 in the region 530 of the chamber 528. Thehigh brightness light 536 emitted by the plasma 532 is directed towardthe reflective surface 540 of the chamber 528. At least a portion of thehigh brightness light 536 is reflected by the reflective surface 540 ofthe chamber 528 and directed toward the reflector 512. The reflector 512is substantially transparent to the high brightness light 536 (e.g., atleast one or more wavelengths of ultraviolet light). In this manner, thehigh brightness light 536 passes through the reflector 512 and isdirected to, for example, a metrology tool (not shown). In someembodiments, the high brightness light 536 is first directed towards orthrough a window or additional optical elements before it is directed toa tool.

In some embodiments, the light source 500 includes a separate, sealedchamber (e.g., the sealed chamber 728 of FIG. 7) located in the concaveregion of the chamber 528. The sealed chamber contains the ionizable gasthat is used to create the plasma 532. In alternative embodiments, thesealed chamber contains the chamber 528. In some embodiments, the sealedchamber also contains the reflector 512.

FIG. 6 is a schematic block diagram of a portion of a light source 600incorporating principles of the present invention. The light source 600includes a chamber 628 that has a reflective surface 640. The reflectivesurface 640 can have, for example, a parabolic shape, elliptical shape,curved shape, spherical shape or aspherical shape. In this embodiment,the light source 600 has an ignition source (not shown) that ignites anionizable gas (e.g., mercury or xenon) in a region 630 within thechamber 628 to produce a plasma 632.

A laser source (not shown) provides a laser beam 616 that is directedtoward a reflector 612. The reflector 612 is substantially transparentto the laser beam 616. The laser beam 616 passes through the reflector612 and is directed toward the reflective surface 640 of the chamber628. The reflective surface 640 reflects the laser beam 616 and directsit toward the plasma 632 in the region 630 of the chamber 628. The laserbeam 616 provides energy to the plasma 632 to sustain and/or generate ahigh brightness light 636 that is emitted from the plasma 632 in theregion 630 of the chamber 628. The high brightness light 636 emitted bythe plasma 632 is directed toward the reflective surface 640 of thechamber 628. At least a portion of the high brightness light 636 isreflected by the reflective surface 640 of the chamber 628 and directedtoward a surface 624 of the reflector 612. The reflector 612 reflectsthe high brightness light 636 (e.g., at least one or more wavelengths ofultraviolet light). In this manner, the high brightness light 636 (e.g.,visible and/or ultraviolet light) is directed to, for example, ametrology tool (not shown). In some embodiments, the high brightnesslight 636 is first directed towards or through a window or additionaloptical elements before it is directed to a tool. In some embodiments,the high brightness light 636 includes ultraviolet light. Ultravioletlight is electromagnetic energy with a wavelength shorter than that ofvisible light, for instance between about 50 nm and 400 nm.

In some embodiments, the light source 600 includes a separate, sealedchamber (e.g., the sealed chamber 728 of FIG. 7) located in the concaveregion of the chamber 628. The sealed chamber contains the ionizable gasthat is used to create the plasma 632. In alternative embodiments, thesealed chamber contains the chamber 628. In some embodiments, the sealedchamber also contains the reflector 612.

FIG. 7 is a schematic block diagram of a light source 700 for generatinglight that embodies the invention. The light source 700 includes asealed chamber 728 (e.g., a sealed quartz bulb) that contains anionizable medium (not shown). The light source 700 provides energy to aregion 730 of the chamber 728 having the ionizable medium which createsa plasma 732. The plasma 732 generates and emits a high brightness light736 that originates from the plasma 732. The light source 700 alsoincludes at least one laser source 704 that generates a laser beam thatis provided to the plasma 732 located in the chamber 728 to initiateand/or sustain the high brightness light 736.

In this embodiment, the laser source 704 is a diode laser that outputs alaser beam via a fiberoptic element 708. The fiber optic element 708provides the laser beam to a collimator 712 that aids in conditioningthe output of the diode laser by aiding in making laser beam rays 716substantially parallel to each other. The collimator 712 then directsthe laser beam 716 to a beam expander 718. The beam expander 718 expandsthe size of the laser beam 716 to produce laser beam 722. The beamexpander 718 also directs the laser beam 722 to an optical lens 720. Theoptical lens 720 is configured to focus the laser beam 722 to produce asmaller diameter laser beam 724. The laser beam 724 passes through anaperture or window 772 located in the base 724 of a curved reflectivesurface 740 and is directed toward the chamber 728. The chamber 728 issubstantially transparent to the laser beam 724. The laser beam 724passes through the chamber 728 and toward the region 730 of the chamber728 where the plasma 732 exists (or where it is desirable for the plasma732 to be generated by the laser 724 and sustained).

In this embodiment, the ionizable medium is ignited by the laser beam724. In alternative embodiments, the light source 700 includes anignition source (e.g., a pair of electrodes or a source of ultravioletenergy) that, for example, generates an electrical discharge in thechamber 728 (e.g., the region 730 of the chamber 728) to ignite theionizable medium. The laser source 704 then provides laser energy to theionized medium to sustain the plasma 732 which generates the highbrightness light 736. The chamber 728 is substantially transparent tothe high brightness light 736 (or to predefined wavelengths ofelectromagnetic radiation in the high brightness light 736). The light736 (e.g., visible and/or ultraviolet light) generated by the lightsource 700 is then directed out of the chamber 728 toward an innersurface 744 of the reflective surface 740.

In this embodiment, the light source 700 includes a plurality of opticalelements (e.g., a beam expander 718, a lens 720, and fiber optic element708) to modify properties (e.g., diameter and orientation) of the laserbeam delivered to the chamber 732. Various properties of the laser beamcan be modified with one or more optical elements (e.g., mirrors orlenses). For example, one or more optical elements can be used to modifythe portions of, or the entire laser beam diameter, direction,divergence, convergence, and orientation. In some embodiments, opticalelements modify the wavelength of the laser beam and/or filter outcertain wavelengths of electromagnetic energy in the laser beam.

Lenses that can be used in various embodiments of the invention include,aplanatic lenses, achromatic lenses, single element lenses, and fresnellenses. Minors that can be used in various embodiments of the inventioninclude, coated mirrors, dielectric coated mirrors, narrow band mirrors,and ultraviolet transparent infrared reflecting mirrors. By way ofexample, ultraviolet transparent infrared reflecting mirrors are used insome embodiments of the invention where it is desirable to filter outinfrared energy from a laser beam while permitting ultraviolet energy topass through the mirror to be delivered to a tool (e.g., a waferinspection tool, a microscope, a lithography tool or an endoscopictool).

FIGS. 8A and 8B are schematic block diagrams of a light source 800 forgenerating light that embodies the invention. The light source 800includes a chamber 828 that contains an ionizable medium (not shown).The light source 800 provides energy to a region 830 of the chamber 828having the ionizable medium which creates a plasma. The plasma generatesand emits a high brightness light that originates from the plasma. Thelight source 800 also includes at least one laser source 804 thatgenerates a laser beam that is provided to the plasma located in thechamber 828 to initiate and/or sustain the high brightness light.

In some embodiments, it is desirable for the plasma to be small in sizein order to achieve a high brightness light source. Brightness is thepower radiated by a source of light per unit surface area into a unitsolid angle. The brightness of the light produced by a light sourcedetermines the ability of a system (e.g., a metrology tool) or anoperator to see or measure things (e.g., features on the surface of awafer) with adequate resolution. It is also desirable for the lasersource 804 to drive and/or sustain the plasma with a high power laserbeam.

Generating a plasma that is small in size and providing the plasma witha high power laser beam leads simultaneously to a high brightness light.The light source 800 produces a high brightness light because most ofthe power introduced by the laser source 804 is then radiated from asmall volume, high temperature plasma. The plasma temperature will risedue to heating by the laser beam until balanced by radiation and otherprocesses. The high temperatures that are achieved in the lasersustained plasma yield increased radiation at shorter wavelengths ofelectromagnetic energy, for example, ultraviolet energy. In oneexperiment, temperatures between about 10,000 K and about 20,000 K havebeen observed. The radiation of the plasma, in a general sense, isdistributed over the electromagnetic spectrum according to Planck'sradiation law. The wavelength of maximum radiation is inverselyproportional to the temperature of a black body according to Wien'sdisplacement law. While the laser sustained plasma is not a black body,it behaves similarly and as such, the highest brightness in theultraviolet range at around 300 nm wavelength is expected for lasersustained plasmas having a temperature of between about 10,000 K andabout 15,000 K. Conventional arc lamps are, however, unable to operateat these temperatures.

It is desirable in some embodiments of the invention to deliver thelaser energy to the plasma in the chamber 828 over a large solid anglein order to achieve a plasma that is small in size. Various methods andoptical elements can be used to deliver the laser energy over a largesolid angle. In this embodiment of the invention, parameters of a beamexpander and optical lens are varied to modify the size of the solidangle over which the laser energy is delivered to the plasma in thechamber 828.

Referring to FIG. 8A, the laser source 804 is a diode laser that outputsa laser beam via a fiberoptic element 808. The fiber optic element 808provides the laser beam to a collimator 812 that aids in conditioningthe output of the diode laser by aiding in making laser beam rays 816substantially parallel to each other. The collimator 812 directs thelaser beam 816 to an optical lens 820. The optical lens 820 isconfigured to focus the laser beam 816 to produce a smaller diameterlaser beam 824 having a solid angle 878. The laser beam 824 is directedto the region 830 of the chamber 828 where the plasma 832 exists.

In this embodiment, the light source 800 also includes an ignitionsource 840 depicted as two electrodes (e.g., an anode and cathodelocated in the chamber 828). The ignition source 840 generates anelectrical discharge in the chamber 828 (e.g., the region 830 of thechamber 828) to ignite the ionizable medium. The laser then provideslaser energy to the ionized medium to sustain or create the plasma 832which generates the high brightness light 836. The light 836 generatedby the light source 800 is then directed out of the chamber to, forexample, a wafer inspection system (not shown).

FIG. 8B illustrates an embodiment of the invention in which the laserenergy is delivered to the plasma in the chamber 828 over a solid angle874. This embodiment of the invention includes a beam expander 854. Thebeam expander 854 expands the size of the laser beam 816 to producelaser beam 858. The beam expander 854 directs the laser beam 858 to anoptical lens 862. The combination of the beam expander 854 and theoptical lens 862 produces a laser beam 866 that has a solid angle 874that is larger than the solid angle 878 of the laser beam 824 of FIG.8A. The larger solid angle 874 of FIG. 8B creates a smaller size plasma884 than the size of the plasma in FIG. 8A. In this embodiment, the sizeof the plasma 884 in FIG. 8B along the X-axis and Y-axis is smaller thanthe size of the plasma 832 in FIG. 8A. In this manner, the light source800 generates a brighter light 870 in FIG. 8B as compared with the light836 in FIG. 8A.

An experiment was conducted in which a beam expander and optical lenswere selected to allow operation of the light source as shown in FIGS.8A and 8B. A Hamamatsu L2273 xenon bulb (with offices in Bridgewater,N.J.) was used as the sealed chamber 828. The plasma was formed in theHamamatsu L2273 xenon bulb using an SPI continuous-wave (CW) 100 W, 1090nm fiber laser (sold by SPI Lasers PLC, with offices in Los Gatos,Calif.)). A continuous-wave laser emits radiation continuously orsubstantially continuously rather than in short bursts, as in a pulsedlaser. The fiber laser 804 contains laser diodes which are used to pumpa special doped fiber (within the fiber laser 804, but not shown). Thespecial doped fiber then lases to produce the output of the fiber laser804. The output of the fiber laser 804 then travels through thefiberoptic element 808 to the collimeter 812. The collimeter 812 thenoutputs the laser beam 816. The initial laser beam diameter (along theY-Axis), corresponding to beam 816 in FIG. 8A, was 5 mm. The laser beam816 was a Gaussian beam with a 5 mm diameter measured to the 1/e²intensity level. The lens used in the experiment, corresponding to lens820, was 30 mm in diameter and had a focal length of 40 mm. Thisproduced a solid angle of illumination of the plasma 832 ofapproximately 0.012 steradians. The length (along the X-Axis) of theplasma 832 produced in this arrangement was measured to be approximately2 mm. The diameter of the plasma 832 (along the Y-Axis), wasapproximately 0.05 mm. The plasma 832 generated a high brightnessultraviolet light 836.

Referring to FIG. 8B, a 2× beam expander was used as the beam expander854. The beam expander 854 expanded beam 816 from 5 mm in diameter(along the Y-Axis) to 10 mm in diameter, corresponding to beam 858. Lens862 in FIG. 8B was the same as lens 820 in FIG. 8A. The combination ofthe beam expander 854 and the optical lens 862 produced a laser beam 866having a solid angle 874 of illumination of approximately 0.048steradians. In this experiment, the length of the plasma (along theX-Axis) was measured to be approximately 1 mm and the diameter measuredalong the Y-Axis remained 0.05 mm. This reduction of plasma length by afactor of 2, due to a change in solid angle of a factor of 4, isexpected if the intensity required to sustain the plasma at its boundaryis a constant. A decrease in plasma length (along the X-Axis) by afactor of 2 (decrease from 2 mm in FIG. 8A to 1 mm in FIG. 8B) resultedin an approximate doubling of the brightness of the radiation emitted bythe plasma for a specified laser beam input power because the powerabsorbed by the plasma is about the same, while the radiating area ofthe plasma was approximately halved (due to the decrease in length alongthe X-Axis). This experiment illustrated the ability to make the plasmasmaller by increasing the solid angle of the illumination from thelaser.

In general, larger solid angles of illumination can be achieved byincreasing the laser beam diameter and/or decreasing the focal length ofthe objective lens. If reflective optics are used for illumination ofthe plasma, them the solid angle of illumination can become much largerthan the experiment described above. For example, in some embodiments,the solid angle of illumination can be greater than about 2π (about6.28) steradians when the plasma is surrounded by a deep, curvedreflecting surface (e.g., a paraboloid or ellipsoid). Based on theconcept that a constant intensity of light is required to maintain theplasma at its surface, in one embodiment (using the same bulb and laserpower described in the experiment above) we calculated that a solidangle of 5 steradians would produce a plasma with its length equal toits diameter, producing a roughly spherical plasma.

FIG. 9 is a schematic diagram of a light source 900 for generatinglight. The light source 900 includes a sealed chamber 928 (e.g., asealed quartz bulb, sealed sapphire tube) that contains an ionizablemedium (not shown). The light source 900 also includes an energy source(not shown). The energy source provides energy to a region of thechamber 928 to produce a plasma 932. The plasma 932 generates and emitsa light 936 that originates from the plasma 932. The light 936 generatedby the light source 900 is directed through the walls 942 of the chamber928 toward the reflective surface 944 of the reflector 940. Thereflective surface 944 reflects the light generated by the light source900.

The walls 942 of the chamber 928 allow electromagnetic energy (e.g.,light) to pass through the walls 942. The refractive index of the wallsis a measure for how much the speed of the electromagnetic energy isreduced inside the walls 942. Properties (e.g., the direction ofpropagation) of the light ray 936 generated by the plasma 932 that isemitted through the walls 942 of the chamber 928 are modified due to therefractive index of the walls 942. If the walls 942 have a refractiveindex equal to that of the medium 975 internal to the chamber 928(typically near 1.0), the light ray 936 passes through the walls 942 aslight ray 936′. If, however, the walls have a refractive index greaterthan that of the internal medium 975, the light ray 936 passes throughthe walls as light ray 936″.

The direction of the light represented by light ray 936 is altered asthe light ray 936 enters the wall 942 having an index of refractiongreater than the medium 975. The light ray 936 is refracted such thatthe light ray 936 bends toward the normal to the wall 942. The lightsource 900 has a medium 980 external to the chamber 928. In thisembodiment, the medium 980 has an index of refraction equal to the indexof refraction of the medium 975 internal to the chamber 928. As thelight ray 936 passes out of the wall 942 into the medium 980 external tothe chamber 928, the light ray 936 is refracted such that the light ray(as light ray 936″) bends away from the normal to the wall 942 when itexits the wall 942 The light ray 936″ has been shifted to follow a routeparallel to the route the light ray 936′ would have followed had therefractive index of the wall 942 been equal to the refractive indices ofthe internal medium 975 and external medium 980.

This refractive shift of direction and the resulting position of thelight ray 936 (and 936′ and 936″) is described by Snell's Law ofRefraction:

n ₁ sin θ₁ =n ₂ sin θ₂  EQN. 1

where, according to Snell's Law, n₁ is the index of refraction of themedium from which the light is coming, n₂ is the index of refraction ofthe medium into which the light is passing, θ₁ is the angle of incidence(relative to the normal) of the light approaching the boundary betweenthe medium from which the light is coming and the medium into which thelight is passing, and θ₂ is the angle of incidence (relative to thenormal) of the light departing from the boundary between the medium fromwhich the light is coming and the medium into which the light is passing(Hecht, Eugene, Optics, M. A., Addison-Wesley, 1998, p. 99-100,QC355.2.H42).

If the internal medium 975 does not have an index of refraction equal tothat of the external medium 980, the light ray 936 refracts to follow aroute according to Snell's Law. The route the light ray 936 follows willdiverge from the route that light ray 936′ follows when the internalmedium 975, wall 942, and external medium 980 do not have equal indicesof refraction.

If the refractive index of the walls 942 of the chamber 928 is equal tothe internal medium 975 and external medium 980, the reflective surface944 reflects light ray 936′ and produces a focused beam of light 956.If, however, the refractive index of the walls 942 is greater than theinternal medium 975 and external medium 980, the reflective surface 944reflects light ray 936″ and does not produce a focused beam (the lightray 936″ is dispersed producing light 960). Accordingly, it is thereforedesirable to have a light source that includes a chamber and areflective surface with a shape configured to compensate for the effectof the refractive index of the walls of the chamber.

In alternative embodiments, the reflective surface 940 is configured toproduce a collimated beam of light when the refractive index of thewalls 942 of the chamber 928 is equal to that of the internal medium 975and external medium 980. However, if the refractive index of the walls942 of the chamber 928 is greater than that of the internal medium 975and external medium 980, the reflective surface 940 would produce anon-collimated beam of light (the reflected light would be dispersed,similarly as described above).

In other embodiments, aspects of the invention are used to compensatefor the effect of the refractive index of the walls 942 of the chamber928 for laser energy directed in to the chamber 928. Laser energy isdirected toward the reflective surface 944 of the reflector 940. Thereflective surface 944 reflects the laser energy through the walls 942of the chamber 928 toward the plasma 932 in the chamber 928 (similarlyas described herein with respect to, for example, FIGS. 5 and 6). If thewalls 942 of the chamber 928 have a refractive index greater than thatof the internal 975 and external 980 media, the direction of the laserenergy is altered as the energy enters the walls 942. In theseembodiments, if the reflective surface 944 of the reflector 942 has ashape configured to compensate for the effect of the refractive index ofthe walls of the chamber, the laser energy entering the chamber 928 willnot diverge. Rather, the laser energy entering the chamber 928 will beproperly directed to the location of the plasma 932 in the chamber 928,similarly as described herein. In this manner, principles of theinvention can be applied to electromagnetic energy (e.g., laser energy)that is directed in to the chamber 928 and electromagnetic energy (e.g.,light) produced by the plasma 932 that is directed out of the chamber928.

FIG. 10A is a schematic block diagram of a light source 1000 a forgenerating light. The light source 1000 a includes a sealed chamber 1028a (e.g., a sealed quartz tube or sealed sapphire tube) that contains anionizable medium (not shown). The light source 1000 a also includes anenergy source 1015 a. In various embodiments, the energy source 1015 ais a microwave energy source, AC arc source, DC arc source, or RF energysource. The energy source 1015 a provides energy 1022 a to a region 1030a of the chamber 1028 a having the ionizable medium. The energy 1022 acreates a plasma 1032 a. The plasma 1032 a generates and emits a light1036 a that originates from the plasma 1032 a. The light source 1000 aalso includes a reflector 1040 a that has a reflective surface 1044 a.The reflective surface 1044 a of the reflector 1040 a has a shape thatis configured to compensate for the refractive index of the walls 1042 aof the chamber 1028 a.

The walls 1042 a of the chamber 1028 a are substantially transparent tothe light 1036 a (or to predefined wavelengths of electromagneticradiation in the light 1036 a). The light 1036 a (e.g., visible and/orultraviolet light) generated by the light source 1000 a is directedthrough the walls 1042 a of the chamber 1028 a toward the innerreflective surface 1044 a of the reflector 1040 a.

If the refractive index of the walls 1042 a is not equal to that of themedia internal and external (not shown) to the chamber 1028 a, theposition and direction of the light ray 1036 a is changed by passingthrough the walls 1042 a of the chamber 1028 a unless the reflectivesurface 1044 a has a shape that compensates for the refractive index ofthe walls 1042 a of the chamber 1028 a. The light 1036 a would disperseafter reflecting off the surface 1044 a of the reflector 1040 a.However, because the shape of the reflective surface 1044 a of thereflector 1040 a is configured to compensate for the refractive index ofthe walls 1042 a of the chamber 1028 a, the light 1036 a does notdisperse after reflecting off the surface 1044 a of the reflector 1040a. In this embodiment, the light 1036 a reflects off the surface 1044 aof the reflector 1040 a to produce a collimated beam of light.

FIG. 10B is a schematic block diagram of a light source 1000 b forgenerating light. The light source 1000 b includes a sealed chamber 1028b (e.g., a sealed quartz tube or sealed sapphire tube) that contains anionizable medium (not shown). The light source 1000 b also includes anenergy source 1015 b. The energy source 1015 b is electrically connectedto electrodes 1029 located in the chamber 1028 b. The energy source 1015b provides energy to the electrodes 1029 to generate an electricaldischarge in the chamber 1028 b (e.g., the region 1030 b of the chamber1028 b) to ignite the ionizable medium and produce and sustain a plasma1032 b. The plasma 1032 b generates and emits a light 1036 b thatoriginates from the plasma 1032 b. The light source 1000 b also includesa reflector 1040 b that has a reflective surface 1044 b. The reflectivesurface 1044 b of the reflector 1040 b has a shape that is configured tocompensate for the refractive index of the walls 1042 b of the chamber1028 b.

The walls 1042 b of the chamber 1028 b are substantially transparent tothe light 1036 b (or to predefined wavelengths of electromagneticradiation in the light 1036 b). The light 1036 b (e.g., visible and/orultraviolet light) generated by the light source 1000 b is directedthrough the walls 1042 b of the chamber 1028 b toward the innerreflective surface 1044 b of the reflector 1040 b.

If the refractive index of the walls 1042 b is not equal to that ofmedia internal and external (not shown) to the chamber 1028 b, thedirection and position of the light ray 1036 b is changed by passingthrough the walls 1042 b of the chamber 1028 b unless the reflectivesurface 1044 b has a shape that compensates for the refractive index ofthe walls 1042 b of the chamber 1028 b. The light 1036 b would disperseafter reflecting off the surface 1044 b of the reflector 1040 b.However, because the shape of the reflective surface 1044 b of thereflector 1040 b is configured to compensate for the refractive index ofthe walls 1042 b of the chamber 1028 b, the light 1036 b does notdisperse after reflecting off the surface 1044 b of the reflector 1040b. In this embodiment, the light 1036 b reflects off the surface 1044 bof the reflector 1040 b to produce a collimated beam of light.

FIG. 11 is a schematic block diagram of a light source 1100 forgenerating light that embodies the invention. The light source 1100includes a sealed chamber 1128 (e.g., a sealed, cylindrical sapphirebulb) that contains an ionizable medium (not shown). The light source1100 provides energy to a region 1130 of the chamber 1128 having theionizable medium which creates a plasma 1132. The plasma 1132 generatesand emits a light 1136 (e.g., a high brightness light) that originatesfrom the plasma 1132. The light source 1100 also includes at least onelaser source 1104 that generates a laser beam that is provided to theplasma 1132 located in the chamber 1128 to initiate and/or sustain thehigh brightness light 1136.

In this embodiment, the laser source 1104 is a diode laser that outputsa laser beam 1120. The optical lens 1120 is configured to focus thelaser beam 1122 to produce a smaller diameter laser beam 1124. The laserbeam 1124 passes through an aperture or window 1172 located in the base1124 of a curved reflective surface 1140 and is directed toward thechamber 1128. The chamber 1128 is substantially transparent to the laserbeam 1124. The laser beam 1124 passes through the chamber 1128 andtoward the region 1130 of the chamber 1128 where the plasma 1132 exists(or where it is desirable for the plasma 1132 to be generated by thelaser 1124 and sustained).

In this embodiment, the ionizable medium is ignited by the laser beam1124. In alternative embodiments, the light source 1100 includes anignition source (e.g., a pair of electrodes or a source of ultravioletenergy) that, for example, generates an electrical discharge in thechamber 1128 (e.g., in the region 1130 of the chamber 1128) to ignitethe ionizable medium. The laser source 1104 then provides laser energyto the ionized medium to sustain the plasma 1132 which generates thelight 1136. The chamber 1128 is substantially transparent to the light1136 (or to predefined wavelengths of electromagnetic radiation in thelight 1136). The light 1136 (e.g., visible and/or ultraviolet light)generated by the light source 1100 is then directed out of the chamber1128 toward an inner surface 1144 of the reflective surface 1140.

The reflective surface 1144 of the reflector 1140 has a shape thatcompensates for the refractive index of the walls 1142 of the chamber1128. If the refractive index of the walls 1142 is not equal to that ofthe media internal and external (not shown) to the chamber 1128, thespeed of the light 1136 would be changed by passing through the walls1142 of the chamber 1128 if the reflective surface 1144 does not have ashape that compensates for the refractive index of the walls 1142 of thechamber 1128 (similarly as described above with respect to FIG. 9).

FIG. 12 is a cross-sectional view of a light source 1200 incorporatingprinciples of the present invention. The light source 1200 includes asealed cylindrical chamber 1228 that contains an ionizable medium. Thelight source 1200 also includes a reflector 1240. The chamber 1228protrudes through an opening 1272 in the reflector 1240. The lightsource 1200 includes a support element 1274 (e.g. a bracket orattachment mechanism) attached to the reflector 1240. The supportelement 1274 is also attached to a back end 1280 of the chamber 1228 andlocates the chamber 1228 relative to the reflector 1240. The lightsource 1200 includes electrodes 1229 a and 1229 b (collectively 1229)located in the chamber 1228 that ignite the ionizable medium to producea plasma 1232. The electrodes 1229 a and 1229 b are spaced apart fromeach other along the Y-Axis with the plasma 1232 located betweenopposing ends of the electrodes 1229.

The light source 1200 also includes an energy source that providesenergy to the plasma 1232 to sustain and/or generate a light 1236 (e.g.,a high brightness light) that is emitted from the plasma 1232. The light1236 is emitted through the walls 1242 of the chamber 1228 and directedtoward a reflective surface 1244 of a reflector 1240. The reflectivesurface 1244 reflects the light 1236.

In some embodiments, the electrodes 1229 also are the energy source thatprovides energy to the plasma 1232 sustain and/or generate the light1236. In some embodiments, the energy source is a laser external to thechamber 1228 which provides laser energy to sustain and/or generate thelight 1236 generated by the plasma 1232, similarly as described hereinwith respect to other embodiments of the invention. For example, in oneembodiment, the light source 1200 includes a laser source (e.g., thelaser source 104 of FIG. 1) and associated laser delivery components andoptical components that provides laser energy to the plasma 1232 toand/or generate the light 1236.

If the refractive index of the walls 1242 of the chamber is equal tothat of the media internal and external (not shown) to the chamber 1228,and the reflective surface 1244 of the reflector 1240 is a parabolicshape, the light 1236 reflected off the surface 1244 produces acollimated beam of light 1264. If the refractive index of the walls 1242of the chamber is equal to that of the media internal and external tothe chamber 1228, and the reflective surface 1244 of the reflector 1240is an ellipsoidal shape, the light 1236 reflected off the surface 1244produces a focused beam of light 1268.

If the refractive index of the walls 1242 of the chamber 1228 is greaterthan that of the media internal and external to the chamber 1228, thedirection and position of the light ray 1236 is changed by passingthrough the walls 1242 of the chamber 1228 unless the reflective surface1244 of the reflector 1240 has a shape that compensates for therefractive index of the walls 1242 of the chamber 1228. The light ray1236 would disperse after reflecting off the surface 1244 of thereflector 1240. However, because the shape of the reflective surface1244 of the reflector 1240 is configured to compensate for therefractive index of the walls 1242 of the chamber 1228, the light 1236does not disperse after reflecting off the surface 1244 of the reflector1240.

In this embodiment, the refractive index of the walls 1242 of thechamber 1228 is greater than that of the internal and external media andthe reflective surface 1242 has a modified parabolic shape to compensatefor the refractive index of the walls 1242. The modified parabolic shapeallows for the reflected light 1236 to produce the collimated beam oflight 1264. If a parabolic shape was used, the reflected light 1236would not be collimated, rather the reflected light would be dispersed.A modified parabolic shape means that the shape is not a pure parabolicshape. Rather, the shape has been modified sufficiently to compensatefor the aberrations that would otherwise be introduced into thereflected light 1236. In some embodiments, the shape of the reflectivesurface 1242 is produced to reduce the error (e.g., dispersing of thereflected light 1236) below a specified value.

In some embodiments, the shape of the reflective surface 1242 isexpressed as a mathematical equation. In some embodiments, by expressingthe shape of the reflective surface 1242 as a mathematical equation, itis easier to reproduce the shape during manufacturing. In someembodiments, parameters of the mathematical equation are selected toreduce error due to the refractive index of the walls 1242 of thechamber 1228 below a specified value.

The light source 1200 includes a seal assembly 1250 at the top of thechamber 1228. The light source 1200 also includes a fitting 1260 at thebottom end of the chamber 1228. The seal assembly 1250 seals the chamber1228 containing the ionizable medium. In some embodiments, the sealassembly 1250 is brazed to the top end of the chamber 1228. The sealassembly 1250 can include a plurality of metals united at hightemperatures. The seal assembly 1250 can be, for example, a valve stemseal assembly, a face seal assembly, an anchor seal assembly, or a shaftseal assembly. In some embodiments the seal assembly 1250 ismechanically fastened to the top end of the chamber 1228. In someembodiments, there are two seal assemblies 1250, located at the two endsof the chamber 1228.

The fitting 1260 allows for filling the chamber with, for example, theionizable medium or other fluids and gases (e.g., an inert gas tofacilitate ignition). The fitting 1260 also allows for controlling thepressure in the chamber 1228. For example, a source of pressurized gas(not shown) and/or a relief valve (not shown) can be coupled to thefitting to allow for controlling pressure in the chamber 1228. Thefitting 1260 can be a valve that allows the ionizable medium to flowinto the chamber 1228 through a gas inlet (not shown).

FIG. 13 is a graphical representation of a plot 1300 of the blur ordispersal produced by a reflective surface (e.g., the reflective surface1244 of FIG. 12) for a reflective surface having various shapes that areexpressed as a mathematical expression having the form of EQN. 2. Theblur or dispersal is the radius by which light rays reflected off of thereflective surface miss the desired remote focus point for the reflectedlight (e.g., the reflected light 1268 of FIG. 12 in the situation wherethe shape of the reflective surface 144 is a modified elliptical shape).

$\begin{matrix}{{r(z)} = \sqrt{\frac{{a_{1}z} + {a_{2}z^{2}} + {a_{3}z^{3}} + \ldots + {a_{n}z^{n}}}{1 + {b_{1}z} + {b_{2}z^{2}} + \ldots + {b_{m}z^{m}}}}} & {{EQN}.\mspace{14mu} 2}\end{matrix}$

The X-axis 1304 of the plot 1300 is the position along the optical axis(in millimeter units) where a particular ray of light reflects from thereflective surface (e.g. the reflective surface 1244) of FIG. 12). TheY-Axis 1308 of the plot 1300 is the radius (i.e., blur or dispersal) inmillimeter units. The cylindrical chamber has an outer diameter (alongthe X-axis) of 7.11 mm and an inner diameter of 4.06 mm. Curve 1312shows the radius by which light rays reflected off of the location alongthe optical axis of the reflective surface miss the desired remote focuspoint for the reflected light, in which the reflective surface isexpressed as a mathematical equation (EQN. 2) in which n=2 and m=0.Curve 1316 shows the radius by which light rays reflected off of thelocation along the optical axis of the reflective surface miss thedesired remote focus point for the reflected light, in which thereflective surface is expressed as a mathematical equation (EQN. 2) inwhich n=3 and m=1. Curve 1320 shows the radius by which light raysreflected off of the location along the optical axis of the reflectivesurface miss the desired remote focus point for the reflected light, inwhich the reflective surface is expressed as a mathematical equation(EQN. 2) in which n=4 and m=4. Curve 1324 shows the radius by whichlight rays reflected off of the location along the optical axis of thereflective surface miss the desired remote focus point for the reflectedlight, in which the reflective surface is expressed as a mathematicalequation (EQN. 2) in which n=5 and m=5.

In this embodiment, a ray tracing program was used to select (e.g.,optimize) the parameters of the mathematical equation so the shape ofthe reflective surface compensates for the refractive index of the wallsof the chamber containing the ionizable medium. Referring to FIG. 13 andEQN 2, the parameters are the order and coefficients of the mathematicalequation. In this embodiment, a ray tracing program was used todetermine the paths of the light rays emitted through the walls of achamber in which the walls had a refractive index greater than that ofthe media internal and external to the chamber, and reflected off areflective surface with a shape described according to EQN. 2 withselected order and coefficients. In this embodiment, the ray tracingprogram graphs the radii by which light rays originating at points alongthe optical path of the reflective surface miss the desired remote focuspoint.

In this embodiment, the order and coefficients of the rationalpolynomial (EQN. 2) are adjusted until the radii by which light raysmiss the remote focus point are within a threshold level of error. Inother embodiments, the order and/or coefficients are adjusted until thefull width at half maximum (FWHM) of the light rays emitted by theplasma converge within a specified radius of the remote focus point. Inone embodiment, the specified radius is 25 μm.

In other embodiments, the ray tracing program graphs the radii by whichlight rays originating at points along the optical path of thereflective surface miss a target collimated area at a specified distancefrom the vertex of the reflective surface. The parameters of themathematical equation expressing the shape of the reflective surface areadjusted until the radii by which light rays miss the target collimatedarea are within a threshold level of error. In other embodiments, theorder and/or coefficients are adjusted until the full width at halfmaximum (FWHM) of the light rays emitted by the plasma is located withina specified radii of a target collimated area at a specified distancefrom the vertex of the reflective surface.

In alternative embodiments of the invention, alternative forms ofmathematical equations can be used to describe or express the shape ofthe reflective surface of the reflector (e.g., reflective surface 1244of reflector 1240 of FIG. 12). The principles of the present inventionare equally applicable to light sources that have different chambershapes and/or reflective surface shapes. For example, in someembodiments, the reflective surface of the reflector has a shape that isa modified parabolic, elliptical, spherical or aspherical shape that isused to compensate for the refractive index of the walls of the chamber.

FIG. 14 is a schematic block diagram of a portion of a light source1400, according to an illustrative embodiment of the invention. Thelight source 1400 includes a sealed chamber 1428 that includes anionizable medium. The light source 1400 also includes a first reflector1440 that has a reflective surface 1444. The reflective surface 1444 canhave, for example, a parabolic shape, elliptical shape, curved shape,spherical shape or aspherical shape. In this embodiment, the lightsource 1400 has an ignition source (not shown) that ignites an ionizablegas (e.g., mercury or xenon) in a region 1430 within the chamber 1428 toproduce a plasma 1432.

In some embodiments, the reflective surface 1444 can be a reflectiveinner or outer surface. In some embodiments, a coating or film islocated on the inside or outside of the chamber to produce thereflective surface 1444.

A laser source (not shown) provides a laser beam 1416 that is directedtoward a surface 1424 of a second reflector 1412. The second reflector1412 reflects the laser beam 1420 toward the reflective surface 1444 ofthe first reflector 1440. The reflective surface 1444 reflects the laserbeam 1420 and directs the laser beam toward the plasma 1432. Therefractive index of the walls 1442 of the chamber 1430 affects the laserbeam 1416 as it passes through the walls 1442 in to the chamber 1430similarly as light passing through the walls 1442 of the chamber 1430 isaffected as described previously herein. If the shape of the reflectivesurface 1444 is not selected to compensate for the refractive index, thelaser energy disperses or fails to focus after entering the chamber 1430and is not focused on the plasma 1432. Accordingly, in this embodiment,the reflective surface 1444 of the reflector has a shape that isselected to compensate for the refractive index of the walls 1442 of thechamber 1430 (similarly as described previously herein with respect to,for example, FIGS. 12 and 13).

The laser beam 1416 provides energy to the plasma 1432 to sustain and/orgenerate a high brightness light 1436 that is emitted from the plasma1432 in the region 1430 of the chamber 1428. The high brightness light1436 emitted by the plasma 1432 is directed toward the reflectivesurface 1444 of the first reflector 1440. At least a portion of the highbrightness light 1436 is reflected by the reflective surface 1444 of thefirst reflector 1440 and directed toward the second reflector 1412.Because the reflective surface 1444 of the reflector has a shape that isselected to compensate for the refractive index of the walls 1442 of thechamber 1430, the light 1436 reflected by the reflective surface 1444produces the desired collimated beam of light 1436 that is directedtowards the second reflector 1412.

The second reflector 1412 is substantially transparent to the highbrightness light 1436 (e.g., at least one or more wavelengths ofultraviolet light). In this manner, the high brightness light 1436passes through the second reflector 1412 and is directed to, forexample, a metrology tool (not shown). In some embodiments, the light1436 is directed to a tool used for photoresist exposure, conductingellipsometry (e.g., UV or visible), thin film measurements.

In some embodiments, the high brightness light 1436 is first directedtowards or through a window or additional optical elements before it isdirected to a tool.

FIG. 15A is a cross-sectional view of a light source 1500 incorporatingprinciples of the present invention. FIG. 15B is a sectional view (inthe Y-Z plane) of the light source 1500 of FIG. 15A. The light source1500 includes a housing 1510 that houses various elements of the lightsource 1500. The housing 1510 includes a sealed chamber 1522 and has anoutput 1580 which includes an optical element 1520 (e.g., a quartzdisk-shaped element) through which light can exit the housing 1510. Thelight source 1500 includes a sealed chamber 1528 that contains anionizable medium (not shown). The light source 1500 also includes areflector 1540. The light source 1500 also includes a blocker 1550. Thelight source 1500 includes electrodes 1529 a and 1529 b (collectively1529) located in part in the chamber 1528 that ignite the ionizablemedium to produce a plasma (not shown). The electrodes 1529 a and 1529 bare spaced apart from each other (along the Y-Axis) with the plasmalocated between opposing ends of the electrodes 1529.

In some embodiments, the electrodes 1529 also are the energy source thatprovides energy to the plasma to sustain and/or generate the light. Inthis embodiment, the energy source is a laser (not shown) external tothe chamber 1528 which provides laser energy 1524 (e.g., infrared light)to sustain and/or generate the light 1530 (e.g., a high brightness lightincluding ultraviolet and/or visible wavelengths) generated by theplasma, similarly as described herein with respect to other embodimentsof the invention. The laser energy 1524 enters the chamber 1528 on afirst side 1594 of the chamber 1528. In some embodiments, the lightsource 1500 also includes associated laser delivery components andoptical components that provide laser energy to the plasma to sustainand/or generate the light 1530. In this embodiment, the light source1500 includes an optical element 1560 to delivery the laser energy 1524from the laser to the plasma to sustain and/or generate the light 1530that is emitted from the plasma.

The light 1530 is emitted through the walls of the chamber 1528. Some ofthe light 1530 emitted through the walls of the chamber 1528 propagatestoward a reflective surface 1532 of the reflector 1540. The reflectivesurface 1532 reflects the light through the optical element 1520 in thehousing 1510 to a focal point 1525 of the reflector 1540. Some of thelight 1536 propagates toward the optical element 1560. The opticalelement 1560 absorbs the light 1536, and the light 1536 is not reflectedthrough the optical element 1520. As a result, the light reflected tothe focal point 1525 is the light 1530 emitted from the plasma that isreflected by the reflector 1540 along paths shown as the regions 1540and 1541. Consequently, the light source 1500 includes dark region 1542due to the light that is radiated toward the optical element 1560 andtherefore not reflected to the focal point 1525 of the reflectors 1540.

Some of the laser energy delivered to the plasma is not absorbed by theplasma. The laser energy that is not absorbed (laser energy 1556)continues to propagate along the positive X-Axis direction towards theend of the housing 1510. The blocker 1550 is suspended on a second side1596 of the chamber 1528. The blocker 1550 is suspended along a path1562 the laser energy 1556 travels. The blocker 1550 is coupled to anarm 1555 that suspends the blocker 1550 in the chamber 1522 of the lightsource 1500. The blocker 1550 blocks the laser energy 1556 to prevent itfrom propagating toward the end of the housing and through an output1580 of the light source 1500.

In this embodiment, the blocker 1550 is a mirror that deflects the laserenergy 1556 that is not absorbed by the plasma away from the opening1520 and towards the walls of the housing 1510 (illustrated as laserenergy 1584). The blocker 1550 reflects the laser energy 1556 toward awall 1588 of the housing 1510. The housing 1510 absorbs part of thereflected laser energy 1584 and reflects part of the laser energy 1584toward the opposite wall 1592 of the housing 1510. A portion of thelaser energy 1584 is absorbed each time it impacts a wall (e.g., wall1588 or 1592) of the housing 1510. Repetitive impact of the laser energy1584 with the walls of the housing 1510 causes the laser energy 1584 tobe substantially (or entirely) absorbed by the walls of the housing1510. The blocker 1550 prevents laser energy (e.g., infrared wavelengthsof electromagnetic energy) from exiting the housing 1510 through theopening 1580 by deflecting the laser energy 1556 using the blocker 1550.As a result, only the light produced by the plasma (e.g., ultravioletand/or visible wavelengths) exits the housing 1510 through the opening1580.

The blocker 1550 is suspended in the housing 1510 in a location wherethe blocker 1550 would not deflect light 1530 reflected by the reflector1540 through the opening 1580 to the focal point 1525. The blocker 1550does not deflect the light 1530 because the blocker 1550 is located inthe dark region 1542. In addition, the arm 1555 coupled to the blocker1550 also does not deflect the light 1530 because the arm is positionedin the housing 1510 in a location that is aligned with the electrode1529 a along the positive X-Axis direction relative to the electrode1529 a. In this manner, the blocker 1550 and arm 1555 are positioned tominimize their blocking of the light 1530.

The dark region 1542 tapers as the region 1542 approaches the opening1580. To prevent the blocker 1550 from deflecting light reflected by thereflector 1540, the laser energy blocker 1550 is positioned at alocation along the X-Axis where the cross-sectional area (in the Y-Zplane) of the blocker 1550 is equal to or less than the cross sectionalarea (in the Y-Z plane) of the dark region 1542. As a result, thesmaller the cross-sectional area (in the Y-Z plane) of the blocker 1550,the closer along the X-Axis the blocker 1550 can be placed to theopening 1580.

In some embodiments, the laser energy blocker 1550 is made of anymaterial that reflects the laser energy 1556. In some embodiments, theblocker 1550 is configured to reflect the laser energy 1556 back towardthe ionized medium in the chamber 1528. In some embodiments, the blocker1550 is a coating on a portion of the chamber 1528. In some embodiments,the blocker is a coating on the optical element 1520 at the opening1580.

In some embodiments, the laser energy blocker 1550 is made of a materialthat absorbs, rather than reflects, the laser energy 1556 (e.g.,graphite). In some embodiments in which the blocker absorbs the laserenergy 1556, the blocker 1550 heats up because it absorbs the laserenergy 1556.

In some embodiments, the blocker 1550 is cooled. The blocker 1550 caninclude one or more coolant channels in the blocker 1550. The lightsource can also include a coolant supply coupled to the coolant channelwhich provides coolant to the coolant channel to cool the blocker 1550.In some embodiments, the light source 1500 includes a gas source (e.g.,a pressurized gas canister or gas blower) to blow gas (e.g., air,nitrogen, or any other gas) on the blocker 1550 to cool the blocker1550. In some embodiments, the light source 1500 includes one or moretubes (e.g., copper tubes) that wind around the laser energy blocker1550. The light source 1500 flows a coolant (e.g., water) through thetubes to cool the blocker 1550.

By way of illustration, an experiment was conducted to generateultraviolet light using a light source, according to an illustrativeembodiment of the invention. A specially constructed quartz bulb with avolume of 1 cm³ was used as the chamber of the light source (e.g., thechamber 128 of the light source 100 of FIG. 1) for experiments usingxenon as the ionizable medium in the chamber. The bulb was constructedso that the chamber formed within the quartz bulb was in communicationwith a pressure controlled source of xenon gas. FIG. 16 is a graphicalrepresentation of brightness as a function of the pressure in a chamberof a light source, using a light source according to the invention. FIG.16 illustrates a plot 1600 of the brightness of a high brightness lightproduced by a plasma located in the chamber as a function of thepressure in the chamber.

The laser source used in the experiment was a 1.09 micron, 200 watt CWlaser and it was focused with a numerical aperture of 0.25. Theresulting plasma shape was typically an ellipsoid of 0.17 mm diameterand 0.22 mm length. The Y-Axis 1612 of the plot 1600 is the brightnessin watts/mm² steradian (sr). The X-Axis 1616 of the plot 1600 is thefill pressure of Xenon in the chamber. Curve 1604 is the brightness ofthe high brightness light (between about 260 and about 400 nm) producedby a plasma that was generated. Curve 1608 is the brightness of the highbrightness light (between about 260 and about 390 nm) produced by theplasma. For both curves (1604 and 1608), the brightness of the lightincreased with increasing fill temperatures. Curve 1604 shows abrightness of about 1 watts/mm² sr at about 11 atmospheres whichincreased to about 8 watts/mm² sr at about 51 atmospheres. Curve 1608shows a brightness of about 1 watts/mm² sr at about 11 atmospheres whichincreased to about 7.4 watts/mm² sr at about 51 atmospheres. Anadvantage of operating the light source with increasing pressures isthat a higher brightness light can be produced with higher chamber fillpressures.

To start a laser-driven light source (“LDLS”), the absorption of thelaser light by the gas within the chamber (e.g., chamber 128 of FIG. 1)is strong enough to provide sufficient energy to the gas to form a denseplasma. However, during operation, the same absorption that was used tostart the LDLS can be too strong to maintain the brightness of the lightbecause the light can be prematurely absorbed before the light is nearthe laser focus. These criteria often come into conflict and can createan imbalance in the absorption needed to start a LDLS and the absorptionneeded to maintain or operate the LDLS. When starting a LDLS, the plasmadensity is generally low and hence, other things being equal, theabsorption is weak. This can cause most of the laser light to leave theplasma region without being absorbed. Such a situation can lead to aninability to sustain the plasma by the laser alone. One solution to thisproblem is to tune the laser to a wavelength near a strong absorptionline of the excited working gas within the chamber (e.g., chamber 128 ofFIG. 1). However, after ignition this same strong absorption can becomea liability because the laser energy can be absorbed too easily beforethe laser power reaches the core of the plasma near the laser focus.This latter condition can lead to a low brightness light sourceradiating from a large volume. One solution to this problem is to tunethe laser wavelength away from the strong absorption line until acondition is reached where the maximum radiance is achieved. The optimumoperating state can be a balance between small plasma size andsufficiently high power absorption. This scenario leads to a lightsource and a method of operation where the laser is first tuned to awavelength nearer the absorption line and then tuned to anotherwavelength further away from the strong absorption line for optimumoperation.

A light source can use an excited gas that has at least one strongabsorption line at an infrared wavelength to produce a high brightnesslight. For example, referring to FIG. 1, the light source 100 includes achamber 128 that has a gas disposed therein. The gas can comprise anoble gas, for example, xenon, argon, krypton, or neon. An ignitionsource 140 can be used to excite the gas within the chamber 128. Theignition source 140 can be, for example, two electrodes. The excited gashas electrons at an energy level that is higher than the energy of thegas at its ground state, or lowest energy level. The excited gas can bein a metastable state, for example, at an energy that is higher than theground state energy of the gas but that lasts for an extended period oftime (e.g., about 30 seconds to about one minute). The specific energylevel of the excited state can depend on the type of gas that is withinthe chamber 128. The excited gas has at least one strong absorption lineat an infrared wavelength, for example at about 980 nm, 895 nm, 882, nm,or 823 nm. The light source 100 also includes at least one laser 104 forproviding energy to the excited gas at a wavelength near a strongabsorption line of the excited gas within the chamber 128 to produce ahigh brightness light 136. The gas within the chamber 128 can beabsorptive near the wavelength of the laser 104.

Operation of the light source to balance the conflicting criteria forstarting and maintaining the high brightness light can comprise tuning alaser (e.g., laser 104 of FIG. 1) to a first wavelength to produce ahigh brightness light and then tuning the laser to a second wavelengthto maintain the high brightness light. The first wavelength can be at anenergy level that is capable of forming and sustaining a dense plasma,thus creating a high brightness light, and the second wavelength can beat an energy level such that the laser energy is not substantiallyabsorbed by the plasma prior to the laser reaching its focus point.

For example, a gas within a chamber (e.g., chamber 128 of FIG. 1) can beexcited with an ignition source. In some embodiments, a drive laser at apower below 1000 W can be used to ignite the plasma. In otherembodiments, a drive laser at a power above or below 1000 W can be usedto ignite the plasma. To ignite the plasma and/or the excited gas withinthe chamber, a LDLS can be operated near the critical point of the gaswithin the chamber. The critical point is the pressure above which a gasdoes not have separate liquid and gaseous phases. For example, thecritical point of xenon is at a temperature of about 290 Kelvin and at apressure of about 5.84 MPa (about 847 psi). In some embodiments, othergases are used, for example neon, argon or krypton can be used. In otherembodiments, combinations of gases can be used, for example, a mixtureof neon and xenon.

After the gas within the chamber is ignited, a laser (e.g., laser 104 ofFIG. 1) can be tuned to a first wavelength to provide energy to theexcited gas in the chamber to produce a high brightness light. Theexcited gas within the chamber absorbs energy near the first wavelength.After the high brightness light is initiated, the laser can be tuned toa second wavelength to provide energy to the excited gas within thechamber to maintain the high brightness light. The second wavelength caneither be less than or greater than the first wavelength. The excitedgas within the chamber absorbs energy near the second wavelength.

The gas within the chamber can be, for example, a noble gas and can haveatoms with electrons in at least one excited atomic state. Noble gasessuch as xenon, argon, krypton or neon can be transparent in the visibleand near infrared range of the spectrum, but this is not the case whenthe gas is at high temperature or in the presence of excited molecularstates, such as excimers. Any condition of the gas which results inpopulation of high energy electronic states, such as the lowest excitedstate (e.g., the excited state closest in energy to the ground state) inxenon, will also result in the appearance of strong absorption lines dueto transitions between the relatively high energy state and any of theseveral higher level states which lie at a level of order 1 eV above it.

FIG. 17 shows a simplified diagram of the relevant energy levels inxenon. Each of the horizontal bars represents an energy level which canbe occupied by an electron in the xenon atom or molecule (dimer). Whenan electron moves between two levels, a photon can be emitted orabsorbed, e.g. a 980 nm photon. The groups of close together horizontalbars on the “Molecular Levels,” or left, side of the diagram show thatthe close association of xenon atoms in the molecule leads to broadeningof the energy levels of the atom into bands. Transitions between thesebands then allow for a broadened range of absorption, which explains theenhanced absorption even at wavelengths some distance (e.g., severalnanometers) away from the exact atomic transition of 980.0 nm.

Still referring to FIG. 17, an example of such an absorption line is theone at about 980 nm and about 882 nm in xenon which is a transition fromthe metastable atomic 5p5(2P°3/2)6s level to the 5p5(2P°3/2)₆p level.The molecules have a corresponding set of transitions yielding abroadened 980 nm or 882 nm line. Such lines are also observed inemission due to the reverse transition.

Other examples of suitable absorption lines in xenon are, for example,881.69 nm, 823.1 nm, and 895.2 nm. Table 1 shows emission and absorptionmeasurements and average temperature of the cathode spot of a xenon arcin the stationary mode. As shown, xenon in the plasma form has multipleabsorbance lines in the IR spectrum. As shown by the high percentage ofenergy that can be absorbed at multiple wavelengths, 881.69 nm, 823.1nm, and 895.2 nm, as well as 980 nm, are good wavelengths that can beused within a LDLS to initiate a high brightness light.

TABLE 1 (as measured by Lothar Klein (April 1968/Vol. 7, No. 4/APPLIEDOPTICS 677)). N_(λ0) Absorption λ(Å) (W cm⁻¹ sr⁻¹ μ⁻¹) (%) T(° K) Xe_(I)8232 5,900 89 10,020 cont 8500 1,615 23 10,750 Xe_(I) 8819 (peak) 4,39097 9,160 (wing) 4,960 90 10,500 Xe_(I) 9800 3,400 89 9,820 Xe_(I) 99233,340 90 9,840 Xe_(I) 10528 892 28.5 9,950 Xe_(I) 11742 906 42.5 9,400Xe_(I) 12623 640 37 9,920 cont 13100 213 17 8,870 Xe_(I) 14733 575 5510,060 Xe_(I) 15418 317 37 9,840

FIG. 18 shows simplified spectral diagrams of the relevant energy levelsin neon, argon, krypton and xenon. Each horizontal bar represents anenergy level which can be occupied by an electron in the neon, argon,krypton, or xenon atom or molecule (dimer). The transition between theseenergy levels in the noble gases, allow for a broadened range ofabsorption. Therefore, these noble gases can be used in a LDLS to startand maintain a high brightness light in accordance with the systems andmethods described herein.

Tuning the laser several nanometer, as can be needed to adjust thewavelength of the laser from a first wavelength to initiate a highbrightness light to a second wavelength to sustain the high brightnesslight, can be accomplished by adjusting the operating temperature of thelaser. FIG. 19 shows a graph of laser output wavelength versustemperature for xenon, which can be used as a tuning mechanism for alaser of a LDLS. The laser bandwidth is approximately 5 nm and the xenonabsorption lines 1905 are shown, for example, at about 980 nm. Forexample, the wavelength of a typical diode laser operating near the 980nm absorption line of xenon can be tuned approximately 0.4 nm per degreeCelsius of temperature change. The specific temperature or range oftemperatures depends on the particular laser. The effect is that thermalexpansion of the laser material causes the length of the laser cavity toincrease with temperature, thereby shifting the resonant wavelength ofthe cavity to a longer wavelength. The temperature of the laser can beset by a thermoelectric cooling device (e.g., a Peltier cooling device)and quickly tuned by varying the current to the thermoelectric cooler(“TEC”). Electronic fan speed control of a cooling fan is another optionfor laser temperature control. Also, electric heating of the laser canbe used to control the temperature. Temperature of the laser can bemonitored by a sensor and controlled by a feedback circuit driving thecooling and/or heating means.

The second wavelength that the laser of the LDLS is tuned to can beapproximately 1 nm to approximately 10 nm displaced from the firstwavelength. In some embodiments, the second wavelength is less than thefirst wavelength and in some embodiments the second wavelength isgreater than the first wavelength. For example, to start a LDLS, thelaser can be tuned to a wavelength of about 980 nm using xenon gaswithin the chamber of the light source. After a high brightness light isinitiated, the laser can be tuned to a wavelength of about 975 nm tomaintain the high brightness light. In some embodiments, the secondwavelength is about 985 nm.

Several different methods can be used to start and maintain the lightsource. In some embodiments, a high voltage pulse is applied to theignition electrodes in the lamp. A DC current of about 1 to about 5 Ampscan initially flow through the resulting plasma from an ignition powersupply. The current can decay exponentially with a time constant ofabout 2 milliseconds. During this time the resulting plasma isilluminated by a focused laser beam at a wavelength of, for example,about 980 nm where the laser temperature is about 35 (see, e.g., FIG.19, which shows that when the laser temperature is at about 35° C. thelaser will emit energy at a wavelength of about 980 nm). The laserplasma is then sustained after the DC current decays to zero. A plasmalight sensor can be used to determine that the plasma is sustained bythe laser and then the laser is cooled to a temperature about 25° C. andthe resulting wavelength of about 975 nm, or a desired predeterminedoperating wavelength, which can be determined by active feedback on theproperties of the laser driven light source, such as radiance (e.g.,brightness) (see, e.g., FIG. 19, which shows that when the lasertemperature is at about 25° C. the laser will emit energy at awavelength of about 975 nm). This method can rely on direct electronheating by the laser, and therefore, can require sufficient electrondensity to couple the laser power. This method can be used for a LDLSthat operates at about 60 W.

In some embodiments, a different starting scheme can be used, which issuitable for low laser powers, for example, laser powers between about10 W and about 50 W. For example, a laser wavelength can be deliberatelytuned to rely on direct absorption of the laser power by the neutralgas, which is absorptive at or near the laser wavelength. However, sincelaser photon energy is low (approximately 1.26 eV for 980 nm), comparedto atomic excited states (e.g., the lowest xenon excited state is about8.31 eV), this method cannot not rely on absorption from the groundstate. In addition, multi-photon effects can require high power andusually a pulsed laser.

Since the starting scheme cannot rely on absorption from the groundstate, the starting scheme can instead rely on absorption from anexcited state. However, this requires that at least one excited state ofthe gas within a chamber of a LDLS be populated with electrons. Someexcited states have long life times, for example, the lifetime ofmetastable xenon is approximately 40 seconds. Due to the long lifetime,the metastable states tend to be preferentially populated. When choosingabsorption lines of a gas near the laser wavelength, it can be preferredto choose those with lower level on a metastable state. In addition, athigh pressures (e.g., pressures greater than about 0.1 bar), pressureand molecular effects broaden the absorption lines.

A certain level of DC arc current can be required to start the LDLS, butless DC arc current can be required for a laser at higher power andoperating closer to an absorption line of the gas within the chamber ofthe light source. A peak DC current can be varied by changing theresistance of a current limiting resistor after a booster capacitor.Threshold current is the laser driving current above which the plasmacan be started when well aligned. Laser output power is proportional tolaser current. Higher laser driving current can also make the lasercenter wavelength closer to an atomic line, for example, closer to 980nm.

FIG. 20 is a graph 2000 of power 2100 versus pressure 2200 for argon2300 and xenon 2400. See Keefer, “Laser-Sustained Plasmas,”Laser-Induced Plasmas and Applications, published by Marcel Dekker,edited by Radziemski et al., 1989, pp. 169-206, at page 191. The graph2000 shows the minimum power (about 30 W, with minimum power occurringbelow 20 atm.) required to sustain plasmas in argon and xenon as well asthe maximum pressure that can be obtained. In addition, at points 2500and 2600, the prior art laser sustained plasma can not be operated atany higher pressure when the laser sustained plasma is operatedaccording to the prior art. For instance, the highest pressure that canbe achieved for xenon 2400 is about 21 atm and the highest pressure thatcan be achieved for argon 2300 is about 27 atm. At these pressures, theprior art laser sustain plasma requires about 50 W of power to sustain axenon plasma and about 70 W of power to sustain an argon plasma.Operating at higher pressure is beneficial because plasmas for thepurpose of light generation can be obtained with higher brightness whilelower powers are required when operated according to the presentinvention.

To obtain lower powers the LDLS can be operated at a wavelength of about980 nm. When the LDLS is operated at 980 nm, a higher maximum pressureis observed than the maximum pressures shown in FIG. 20. In addition, amaximum pressure, similar to that shown in FIG. 20, has not beenachieved when a LDLS is operated at 980 nm. Therefore, when the LDLS isoperated at the 980 nm wavelength, the LDLS can be operated atsubstantially higher pressures than prior art laser sustained plasmas.For example, the LDLS can be operated at pressures greater than about 30atm. When the LDLS is operated at these high pressures and at awavelength of about 980 nm, the power needed to sustain the plasma dropsdramatically. For example, when the LDLS is operated at a pressuregreater than about 30 atm, the power need to sustain the plasma can beas low as about 10 W.

FIG. 21 shows different sized laser beams 2105, 2110, 2115 focused on asmall plasma 2120. Each laser beam 2105, 2110, 2115 has a differentnumerical aperture (“NA”), which is a measure of the half angle of acone of light. The NA is defined to be the sine of the half angle of thecone of light. For example, laser beam 2105 has a smaller NA than laserbeam 2110, which has a smaller NA than laser beam 2115. As shown in FIG.21, a laser beam with a larger NA, for example, laser beam 2115, canhave an intensity that converges more quickly on plasma 2120 (e.g., itcan converge more quickly to the laser focal point) than a laser beamwith a smaller NA, for example, laser beam 2105. In addition, laserbeams with a larger NA can rapidly decrease in intensity as the laserbeam leaves the focus point and thus will have less of an effect on thehigh brightness light than a laser beam with a smaller NA. For example,laser beam 2105′ corresponds to laser beam 2105, laser beam 2110′corresponds to laser beam 2110, and laser beam 2115′ corresponds tolaser beam 2115. As shown by FIG. 21, the intensity of laser beam 2115decreases more rapidly (2115′) after the focus point than laser beam2105 due to the larger NA of beam 2115, which also results in lessinterference of the laser beam with the high brightness light.

Referring to FIG. 1, a light source 100 can utilize the NA property of abeam of light to produce a high brightness light. The light source 100can include a chamber 128 having one or more walls. A gas can bedisposed within the chamber 128. At least one laser 104 can provide aconverging beam of energy focused on the gas within the chamber 128 toproduce a plasma that generates a light emitted through the walls of thechamber 128. The NA of the converging beam of energy can be betweenabout 0.1 or about 0.8, or between about 0.4 to about 0.6, or about 0.5.

In some embodiments, the laser 104 is a diode laser. A diode laser caninclude optical elements and can emit a converging beam of energywithout any other optical elements present in the optical system. Insome embodiments, an optical element is positioned within a path of thelaser beam, for example, referring to FIG. 1, an optical element can bepositioned between the laser 104 and the region 130 where the laser beamenergy is provided. The optical element can increase the NA of the beamof energy from the laser. The optical element can be, for example, alens or a mirror. The lens can be, for example, an aspheric lens. InFIG. 1, the combination of beam expander 118 and lens 120 serves toincrease the NA of the beam. For example, a NA of 0.5 can be achievedwhen the illuminated diameter of lens 120 is equal to its focal lengthmultiplied by 1.15. These conditions correspond to a beam half angle of30 degrees.

A laser beam having a large numerical aperture can be beneficial becausea laser beam with a large NA can converge to obtain a high intensity ina small focal zone while having an intensity which rapidly decreasesoutside the small focal zone. This high intensity can sustain theplasma. In some embodiments, it is beneficial to have the plasma be in asphere. A laser beam with a large NA can help to maintain the plasma ina spherical shape because of the convergence and focus of the laser beamon the plasma. In addition, a laser beam with a large NA can increasethe spectral radiance or brightness of the emitted light because a highintensity light is emitted from a small, spherical plasma. In someembodiments it is beneficial to have the plasma be in any othergeometric shape, including but not limited to an oval. In someembodiments, an aspheric lens for laser focus is used to achieve high NAand small plasma spot size.

FIG. 22 is a graph 2200 showing spectral radiance on the y-axis and NAon the x-axis. As shown on FIG. 22, spectral radiance of the plasmaincreases with an increase in numerical aperture of the beam. Forexample, for a laser tuned to approximately 975 nm, as NA increases upto 0.55, the spectral radiance also increases. For example, when the NAis about 0.4, the spectral radiance is about 15 mW/nm/mm²/sr. When theNA is increased to about 0.5, the spectral radiance increases to about17 mW/nm/mm²/sr. Therefore, when the NA was increased by about 0.1, thespectral radiance increased by about 2 mW/nm/mm²/sr. A laser beam havingan NA of about 0.5 can produce a higher brightness light than a laserbeam having a smaller NA.

FIG. 23A shows a bulb 2300 having a chamber 2305 that can be used in aLDLS. To assure reliable ignition of a LDLS, a high degree of alignmentcan be achieved between the focus of the laser and a point 2315 withinthe bulb 2300 which lies on a line between the tips of the electrodes2310, 2311 used for ignition and is approximately equidistant from thetips of the electrodes 2310, 2311. This line is important because theinitial arc used for ignition of the laser plasma follows close to thisline. In addition to this requirement, there can also be a need forsimple replacement of a bulb at the point of use of the LDLS withoutcomplex alignment procedures. In the case of prior art aligned bulbs,the purpose of pre-alignment is to provide alignment of the light sourcezone with an optical system. That goal can be met in the LDLS byalignment of the laser beam, not the bulb, which assures alignment ofthe light emitting zone during operation and which alignment remainsfixed independent of the replacement of a bulb. Therefore the purposeachieved by pre-aligning the bulb in the LDLS is primarily that of LDLSignition, not optical alignment of the light emitting zone. In someembodiments, the lamps or bulbs can be pre-aligned. In one embodiment,the electrodes are positioned within a tolerance of about 0.01 to about0.8 mm, and more specifically that the electrodes are within a toleranceof about 0.1 to about 0.4 mm. In some embodiments, the center of theplasma should be within about 0.001 to 0.02 mm of the center of the gapbetween the electrodes. With these tight tolerances, it can bebeneficial to have the lamps/bulbs pre-aligned so that the end user doesnot have to align the lamps/bulbs upon replacement.

A bulb for a light source can be pre-aligned so that an operator of thelight source does not have to align the bulb prior to use. The bulb 2300having two electrode 2310, 2311 can be coupled to a mounting base 2320,as shown in FIG. 23B. The bulb 2300 can be coupled to the mounting base2320 by a dog-point set screw, a nail, a screw, or a magnet.

The bulb and mounting based structure can be inserted into a cameraassembly, for example, camera assembly 2400 of FIG. 24. The cameraassembly includes at least one camera, for example, cameras 2405, 2410and a display screen (not shown). The camera assembly 2400 can includemore than two cameras. In some embodiments, a master pin 2415 is placedin an alignment base 2420. The alignment base 2420 and master pin 2415can be placed into the camera assembly 2400 for use as a bulb centeringtarget. After the camera assembly 2400 is initially set up with thealignment base 2420 and master pin 2415, the bulb 2300 and mounting base2320 of FIG. 23B can be inserted into the camera assembly 2400 in placeof the alignment base 2420 and master pin 2415.

The two cameras 2405, 2410 can be arranged to look at the bulb from twoorthogonal directions to allow a high accuracy (25 to 50 microns) whenthe bulb is positioned correctly with respect to the mounting base. Themounting base can be made of metal or any other suitable material.

FIG. 25 shows a display screen 2500 that can be displayed from at leastone of the cameras (e.g., cameras 2405, 2410 of FIG. 24) when a bulb(e.g., bulb 2300 of FIG. 23B) is mounted in the camera assembly (e.g.,camera assembly 2400 of FIG. 24). The display screen can show twoelectrodes 2505, 2510 that are within a bulb. The arrows 2515, 2520 canbe used to help position the electrodes 2505, 2510 and thus the bulb ina mounting base. The center point 2525 can be positioned equidistantfrom the tips of the electrodes 2505, 2510 when the tip of theelectrodes 2505, 2510 is aligned with the arrows 2515, 2520,respectively. The arrows 2515, 2520 and the center grid 2530 cancomprise a positioning grid with which the electrodes are aligned. Ifthe bulb assembly is not positioned correctly within the mounting base(and thus the electrodes do not align properly in the display screen2500), the position of the bulb within the mounting base can be adjustedsuch that a region of the bulb between the two electrode (e.g., centerpoint 2525) aligns with a positioning grid on the display screen 2500.The position of the bulb can be adjusted either vertically orhorizontally within the mounting base to align the electrodes 2505, 2510with the positioning grid. The position of the bulb can be adjusted by amanipulator that is positioned above the bulb when the bulb is in thecamera assembly. The manipulator can be capable of moving the bulbvertically and horizontally. For example, the manipulator can be arobotized arm that can clamp to the bulb. The robotized arm can bemoved, for example, by a computer program.

In some embodiments, the method of pre-aligning the bulb includestoggling between the two cameras (e.g., cameras 2405, 2410 of FIG. 24)to align the bulb. The display screen 2500 and a predetermined grid canchange based on what camera is being displayed. In some embodiments, theimages from the cameras are displayed side-by-side on the displayscreen. In some embodiments, the images from the two cameras aredisplayed in different colors, for example, one camera can display animage in red while another camera can display an image in green.

The positioning grid on the display screen can be pre-determined suchthat when the center area 2525 of the bulb between the two electrodes2505, 2510 aligns with the positioning grid on the display screen, theregion 2525 is aligned relative to a focal point of a laser when thebulb and mounting base are inserted into a light source. When the bulbhas been aligned, the bulb can be secured to the mounting base. In someembodiments, cement is cured to fix the bulb position permanently in thebase. In some embodiments any other type of securing or fasteningagent/material can be used to secure the bulb position permanently inthe base. This pre-aligned bulb can be used by inserting the pre-alignedbulb into a light source. The user does not have to align the bulb inany way. The user can simply insert the pre-aligned bulb into a LDLSwithout having to make any adjustments for alignment.

The mounting base can guarantee the alignment of the bulb when the bulbis placed into the LDLS. In one embodiment the base has one or morealignment features to guarantee the alignment of the bulb when it isplaced into the LDLS. In another embodiment, the base has one or moremating features, for example, apertures, grooves, channels, orprotuberances, to guarantee the alignment of the bulb when it is placedinto the LDLS.

A feedback loop can be installed in the LDLS to decrease the amount ofnoise within the LDLS. Noise can occur due to gas convection within thebulb or outside the bulb. Noise can also occur due to mode changeswithin the laser, and especially within laser diodes or due tomechanical vibration generated within or outside the LDLS. One solutionto decrease the amount of noise is to install a feedback loop. Anothersolution to decrease the amount of noise is to tilt the laser to 90degrees from a horizontal plane of the plasma. Another solution is toprecisely stabilize the temperature of the laser, for example by sensingthe laser temperature and using a feedback control system to maintain aconstant temperature. Such a temperature stabilization system canutilize a thermoelectric cooler controlled by the feedback system. Insome embodiments, the amount of noise increases as the laser is tiltedcloser to horizontal.

FIG. 26 shows a flow chart 2600 for a method of decreasing noise withina light source. A sample of light that is emitted from the light sourcecan be collected (step 2610). The sample of light that is collected fromthe light source can be collected from a beam splitter. The beamsplitter can be a glass beam splitter or a bifurcated fiber bundle. Thesample of light can be collected using a photodiode. The photodiode canbe within a casing of the light source or the photodiode can be externalto the casing of the light source. In some embodiments, two samples oflight are collected. One sample can be collected by a first photodiodewithin the casing of the light source and one sample can be collected bya second photodiode external to the casing of the light source. Thesample of light can be converted to an electrical signal (step 2620).The electrical signal can be compared to a reference signal to obtain anerror signal (step 2630). The error signal can be the difference betweenthe reference signal and the electrical signal. The error signal can beprocessed to obtain a control signal (step 2640). In some embodiments,the error signal is processed by a control amplifier. The controlamplifier can be capable of outputting a control signal proportional toat least one of a time integral, a time derivative, or a magnitude ofthe error signal. A magnitude of a laser of the light source can be setbased on the control signal to decrease noise within the light source(step 2650). Steps 2610-2650 can be repeated until a desired amount ofnoise is reached. Once the desired amount of noise is reached, steps2610-2650 can continue to be repeated to maintain the amount of noisewithin the system. Steps 2610-2650 can be carried out by analog ordigital electronics in a manner whereby the steps are not discrete, butrather form a continuous process.

FIG. 27 shows a schematic illustration of a functional block diagram2700 of an embodiment of a feedback loop. The circuit can consist of oneor more modules 2705, 2706. In one embodiment, the circuit consists oftwo modules, for example, a lamp controller module 2705 and a lamp housemodule 2706. In one embodiment, universal AC 2710 is put into an AC toDC converter 2715. In one embodiment the AC power input is about 200 W.The AC to DC converter 2715 converts AC power to DC power. In someembodiments, the DC power is provided to a Laser Drive 2720. The laserdrive 2720 can then operate the laser 2725, for example an IPG diodelaser. In some embodiments, the laser 2725 is operated at about 975 nmand in other embodiments the laser is 2725 operated at about 980 nm. Thelaser 2725 can be coupled to a fiber 2730, for example a fiber opticcable, which transmits the laser beam to a bulb 2735. In someembodiments the bulb 2735 is a quartz bulb that is greater than 180 nm.

In some embodiments, output light from the LDLS is stabilized so thatthe noise over a bandwidth of greater than 1 KHz is substantiallyreduced and long term drift is prevented. In some embodiments, a sampleof the output beam is obtained by a beam splitter, or other means, sothat the sample of light is taken effectively from the same aperture andthe same NA or solid angle as the output light is taken from.

As an example, a glass beam splitter can be placed in the beam. A fewpercent of the output power can be deflected from the beam, but itretains all the angular and spatial character of the actual output beam.Then, this sample is converted to electrical current by a detector andcompared to a preset or programmable reference level. A signalrepresenting the difference between the reference and actual detectorcurrent, e.g., an error signal, can then be processed by a controlamplifier having, for example, the capability to produce an outputcontrol signal proportional to any or all of the time integral, the timederivative, and the magnitude of the error signal. The output of thiscontrol amplifier then sets the magnitude of the current flowing in thelaser diode. The variation in laser output produced in this way cancancel out any fluctuation or drift in the output beam power.

In some embodiments, one or more modules are connected to a tool 2740.The tool 2740 can be any device that can utilize a LDLS, for example, ahigh pressure/performance liquid chromatography machine (“HPLC”). Insome embodiments, the tool 2740 contains a photodiode 2745 that convertsthe light emitted from the LDLS into either current or voltage. In someembodiments, the photodiode 2745 sends a signal 2746 to a control board2750 that contains a closed loop control. This signal 2746 can then becompared with a reference signal and the resulting error signal can beused to adjust the LDLS so that the light monitored by the photodiode2745 remains at a constant value over time.

In some embodiments, water is used to cool the lamp control module 2705.In some embodiments, purge gas and/or room air are used to cool the lamphouse module 2706. In some embodiments, other coolants are used to coolthe lamp control module 2705 or the lamp house module 2706. In someembodiments the laser module is cooled by a thermoelectric cooler.

The lamp house module 2706 can also include an igniter module 2755 thatcan be used to excite a gas within a chamber of the light source. Thelamp house module 2706 can include a photodiode 2760 and a photodiodeconditioning circuit 2765. The photodiode 2760 can provide a currentsignal proportional to the intensity of the high brightness light.Photodiode conditioning circuit 2765 can provide a robust, bufferedelectrical signal suitable for transmitting the photodiode signal toremotely located electronic control circuits. The photodiode signal canbe used to establish that the lamp is ignited and operating properly andit can be used in an internal feedback loop as described herein.

FIG. 28 shows a control system block diagram 2800 that employs twofeedback loops. For example, one feedback loop can use an externalphotodiode (see the bolded boxes of FIG. 28) and another feedback loopcan use an internal photodiode (see the bolded, dashed boxes of FIG.28). In some embodiments, the external diode feedback loop results in a0.3% pk-pk noise level. In some embodiments, the external photodiodefeedback loop is a closed loop control (“CLC”) system with feedback froma sample of the output beam, sampled with the same aperture and NA asthe output beam.

The control system block diagram 2800 employing two feedback loopsincludes three modules, a lamp controller module 2805, a lamp housemodule 2806, and a fixture module 2807. Within the lamp controllermodule 2805 an internal reference 2810 is provided to a comparison tool2815. The comparison tool can be a summing junction. The lamp controllermodule 2805 also includes a power supply 2820 to the laser that canobtain a signal from an external feedback PI controller 2825, aninternal feedback PI controller 2830 or a fixed set point 2835 dependingon the circuit 2840. For example, as shown in FIG. 28, the power supply2820 is receiving a signal from the internal feedback PI controller2830.

The power supply 2820 sends power to a bulb 2845 within the lamp housemodule 2806. Light 2850 is emitted from the bulb 2845. A portion of thelight 2850 can be used for the internal feedback loop. The internalfeedback loop within the lamp house module 2806 includes optics 2855, adetector 2860, and a pre-amplified calibration, noise and power feedback2865. The internal feedback loop can be send a signal to the comparisontool 2815 to be compared to the internal reference 2810 to obtain anerror signal.

The light 2850 emitted from the bulb 2845 can be sent to optics 2870.The light 2875 emitted from the optics 2870 can be the high brightnesslight that is used in a variety of applications, for example, an HPLCdevice. A portion of the light 2870 can be used for the externalfeedback loop. The internal feedback loop within the fixture module 2807includes optics 2880, a detector 2885, and a pre-amplified calibration,noise and power feedback 2890. The external feedback loop can send asignal to the comparison tool 2815 to be compared to the internalreference 2810 or the internal feedback loop signal to obtain an errorsignal.

In some embodiments, the feedback system can correct the laser drivecurrent to maintain a constant intensity of light as measured in asample of the output beam sampled from the same spatial region of theemitting area and from the same solid angle used in the application. Insome embodiments, a beam splitter is used to obtain such a sample anddeliver the sample of light to a photodetector, which generates thefeedback signal.

FIG. 29 shows an optical system 2900 of a light source with a noisemeasurement system and feedback loop. The optical system includes acollimator and focusing lens 2905 that focuses a beam of light 2910 froma laser (not shown) on a chamber 2915 of a bulb 2920. The light 2910 isemitted from the plasma 2925 within the chamber 2915 toward an off axisparabolic mirror (“OAP”) 2930. The light continues though an iris 2935,for example a 10 mm iris, and an optical filter 2940 to a second OAP2945. The light 2910 passes through an aperture 2950, for example a 200μm aperture. A beam sampler 2955 can be used to deflect a portion of thelight 2910 to a feedback detector photodiode 2960 to be used as a samplein the feedback loop. The remaining light 2910 continues to an outputbeam detector photodiode 2965. The optical system 2900 simulates anapplication of the light source and allows measurement of the noiselevel achieved in the light reaching the output beam detector photodiode2965, which light and noise level are representative of the lightentering a users optical system, such as an HPLC detector.

The use of a feedback loop or closed loop control (“CLC”) can decreasethe amount of noise within a light source. Table 2 shows noisemeasurement data with and without a CLC circuit. Averaged for manyscans, the Pk-Pk/Mean in a 20 second period is 0.74% without using a CLCsystem, and 0.47% with a CLC system. Even for a 200 second period thenoise is 0.93% without CLC, and 0.46% with a CLC.

TABLE 2 Pk-Pk/Mean noise for LDLS with or without CLC LDLS without LDLSwith Pk-Pk/Mean (%) CLC CLC 200 ms 0.39 0.33 2 s 0.61 0.44 20 s 0.740.47 200 s 0.93 0.46

As shown in FIG. 29 the plasma 2925 is imaged by the second OAP 2945reflector onto a 200 μm aperture at the front end of a lens tube. Aquartz lens (1″ diameter, 25 mm focusing length, Edmund Optics,NT48-293) is mounted in the same lens tube and forming a 1:1 image ofthe aperture 2950 to a noise measurement photodiode 2965 (ThorlabsDET25K) through a beam sampler 2955 (fused silica, 0.5° Wedged,Thorlabs, BSF10-A1). The beam reflected by the beam sampler 2955 isfocused to a second photodiode 2960 (Thorlabs DET25K) which is thedetector for a closed-loop control system. There is no aperture in frontof the photodiodes so the photodiodes were under-filled by the image ofthe 200 μm aperture.

In some embodiments, the LDLS noise is caused by the laser mode hopping.The output spectrum of a semiconductor laser employed for a LDLS has adiscrete set of frequencies i.e., modes. Small fluctuation of thecurrent running through the laser diode or laser temperature can causethe laser diode to switch to the different set of modes. Theinstantaneous switching between modes is called mode hopping. The modehopping can cause rapid changes in the laser output spectrum and outputpower. As the plasma emission intensity depends on these parameters, themode hopping also causes changes of the LDLS radiance and therefore cancompromise the LDLS stability. This effect is undesirable as highstability is required for LDLS used for absorption detectors inchromatography applications.

To eliminate the negative impact of the mode hopping on the LDLSstability, the current of the semiconductor laser can be modulated at afrequency of a few tens of kHz. The amplitude of modulation is about10-20% of the total laser current. The modulation of the current cancause intentional switching of the laser diode between different sets ofmodes. If this switching occurred slowly it can be observed and measuredas noise by instruments having a certain bandwidth, or a predeterminedfrequency band. However, a rapid modulation of the laser current, at afrequency greater than the predetermined frequency band, andcorresponding rapid mode hopping, can have effects which are averagedout when measured within the predetermined frequency band. As an exampleof an application requiring low noise, the measurement in thechromatography application is relatively slow and takes about 0.1-2.0seconds and therefore the frequency band of interest when measuringnoise in that case is primarily about 0.5 Hz to 10 Hz and secondarilyabout 0.1 Hz to 100 Hz to allow for digital sampling of the data. Thefrequency of the modulation imposed on the laser current can then be afrequency higher than about 100 Hz and preferably about 10 kHz to 100kHz. Multiple oscillations of the laser current can occur during theperiod of the measurement. The contribution of different modes averagedduring the period of the measurement leads to effective reduction ofnoise in chromatographic measurements.

Some applications, for which the LDLS can be used, for example aspectrometer, have light detectors that are sensitive in a specificwavelength range. A LDLS can output a high brightness light that isabout 20 times as bright in the most sensitive wavelength range of thedetector as previous light sources. This dramatic increase in spectralradiance can saturate the detector of the application, which can resultin the application not being able to take advantage of light outside thedetector's most sensitive wavelength range, even though the LDLS canhave its greatest practical advantage outside the detector's mostsensitive range, e.g., in the deep ultraviolet range. In other words,the high radiance in a less useful part of the wavelength spectrum canresult in an inability to use the high radiance in the useful part ofthe spectrum.

One solution to this problem is to use a light source that has a chamberwith a gas disposed therein, an ignition source of exciting the gas andat least one laser for providing energy to the excited gas within thechamber to produce a high brightness light. The high brightness lighthas a first spectrum. The light source also includes an optical elementdisposed within the path of the high brightness light to modify thefirst spectrum of the high brightness light to a second spectrum. Theoptical element can be, for example, a prism, a weak lens, a stronglens, or a dichroic filter. The second spectrum can have a relativelygreater intensity of light in the ultraviolet range than the firstspectrum. The first spectrum can have a relatively greater intensity oflight in the visible range than the second spectrum. The optical elementcan increase the intensity of the light at certain wavelengths relativeto the intensity of light at certain other wavelengths.

FIG. 30 shows a schematic illustration of a weak lens method 3000 formodifying a spectrum of a high brightness light. High brightness lightfrom a LDLS 3005 is sent via a delivery fiber 3010 to a filter 3015. Aweak lens 3020, which can focus certain, pre-determined wavelengthsbecause the refractive index of the lens material is dependent onwavelength modifies the spectrum of the high brightness light. The lenscan be made of glass or fused quartz or other materials whose refractiveindex is wavelength dependent. The spectrum is modified because thechromatic aberration of the weak lens causes some wavelengths of thelight to focus at the aperture of the application 3050, while otherwavelengths fail to focus there and are lost from the system. The highbrightness light with a modified spectrum then goes to two OAPs 3025,3030 and then to a beam splitter 3035. The beam splitter 3035 can send aportion of the high brightness light with the modified spectrum to afeedback fiber 3040. This sample of the light can be sent to aphotodiode and PID controller 3045. The PID controller 3045 can controlthe current to the LDLS 3005 to maintain a constant output of highbrightness light. The remainder of the high brightness light can be sentto an application 3050, for example a spectrometer. The light sent tothe application can have a modified spectrum from the original highbrightness light emitted from the LDLS 3005 due to the light passingthrough the weak lens 3020.

FIG. 31 shows a schematic illustration of a strong lens method 3100 formodifying a spectrum of a high brightness light. Similar to the weaklens method of FIG. 30, high brightness light from a LDLS 3005 is sentvia a delivery fiber 3010 to a filter 3015. The high brightness lightthen goes to an OAP 3025. A strong lens 3027 exhibiting chromaticaberration, as for the weak lens above, is positioned between the OAP3025 and a beam splitter 3035. The strong lens 3027 can focus certain,pre-determined wavelengths to modify the spectrum of the high brightnesslight. After the high brightness light is modified, the light can besent to an application 3050, for example a spectrometer. The light sentto the application can have a modified spectrum from the original highbrightness light emitted from the LDLS 3005 due to the light passingthrough the strong lens 3020. The beam splitter 3035 can send a portionof the high brightness light with the modified spectrum to a feedbackfiber 3040. This sample of the light can be sent to a photodiode and PIDcontroller 3045. The PID controller 3045 can control the current to theLDLS 3005 to adjust the current to maintain a constant output of highbrightness light.

FIG. 32 shows a schematic illustration of a filter method 3200 formodifying a spectrum of a high brightness light. High brightness lightfrom a LDLS 3005 is sent via a delivery fiber 3010 to a filter 3015. Thehigh brightness light then goes to two OAPs 3025, 3030. A reflectivefilter 3205 is positioned between OAP 3030 and application 3050. Thereflective filter 3205 can filter certain, pre-determined wavelengths tomodify the spectrum of the high brightness lights. The light sent to theapplication 3050 can have a modified spectrum from the original highbrightness light emitted from the LDLS 3005 due to the light passingthrough the reflective filter 3205. For example, the reflective filtercan use many layers of materials having differing refractive indexes andbe designated so that shorter wavelengths are efficiently reflectedwhereas longer wavelengths are at least partially transmitted orabsorbed by the filter. A transmissive filter can also be applied.

FIG. 33 shows a schematic illustration of a prism method 3300 formodifying a spectrum of a high brightness light. High brightness lightfrom a LDLS 3005 is sent via a delivery fiber 3010 to a filter 3015. Thehigh brightness light then goes to two OAPs 3025, 3030. A prism 3305,for example a 20° quartz prism, is positioned between the output OAP3030 and the application 3050. The prism disperses the light accordingto wavelength and produces an elongated focus spot that contains a shortwavelength enhanced spectrum at one end and a long wavelength enhancedspectrum at the other end. The light sent to the application 3050 canhave a modified spectrum from the original high brightness light emittedfrom the LDLS 3005 due to the light passing through the prison 3305. Forexample, if the position of the elongated focus spot is adjusted so thatthe aperture leading into the application 3050 receives light from oneend of the elongated focus spot the spectrum of light in the applicationwill be primarily short wavelength light and long wavelengths will besuppressed.

In some embodiments, it is desirable to minimize the laser power in thelight source output to reduce the amount of safety procedures that arerequired to operate the LDLS. FIG. 34 is a schematic illustration of alaser-driven light source 3400. To minimize the laser power in the lightsource output, the laser beam 3410 is positioned to contact a mirror3430. The mirror 3430 re-directs the laser beam at a 90° angle to theplasma 3420. Light output from the laser-driven light source 3400 isemitted from the system horizontally. In some embodiments, an absorbingstructure or coating is placed on the inside of the enclosure 3470 wherethe residual laser beams (e.g., laser beams that are unabsorbed by theplasma) will strike after transiting the bulb.

In some embodiments the mirror 3430 selectively reflects the laserwavelength. The mirror 3430 can be used to deliver the laser beam 3410to the plasma 3420 as well as reduce the back reflection of light fromthe plasma to the laser and/or the laser delivery fiber 3440. Forexample, the mirror can be a dichroic mirror positioned within the pathof the laser such that the laser energy is directed toward the plasma.The dichroic mirror can selectively reflect at least one wavelength oflight such that the light generated by the plasma is not substantiallyreflected toward the at least one laser. The dichroic mirror cancomprise glass with multiple layers of dielectric optical coatings.

The optical coating can reflect energy at one wavelength and transmitenergy at a different wavelength. Therefore, the dichroic mirror canreflect the wavelength energy of the laser to the plasma 3420. The highbrightness light that is produced by the plasma can have a differentwavelength than the laser energy. The high brightness light can passthrough the mirror 3430 instead of being reflected back to the laser.

In some embodiments, the mirror 3430 helps keep the fiber end and/or theconnector from being damaged. In other embodiments, the mirror is usedto change the direction of the laser beam 3410.

A LDLS has numerous applications. For example, a LDLS can be used toreplace D₂ lamps, xenon arc lamps, and mercury arc lamps. In addition, aLDLS can be used for HPLC, UV/VIS spectroscopy/spectrophotometry, andendoscopy. Furthermore, a LDLS can be used in a microscope illuminatorfor protein absorption at 280 nm and DNA at 260 nm. A LDLS can also beused for general illumination in a microscope and for fluorescenceexcitation in a fluorescence based instrument or microscope. A LDLS canalso be used in a confocal microscope.

A LDLS can also be used for circular dichroism (“CD”) spectroscopy. ALDLS can provide brighter light at shorter wavelengths with lower inputpower, as compared to high wattage xenon arc lamps currently used. Inaddition, a LDLS can be used in atomic absorption spectroscopy toprovide a brighter light source than arc lamps currently used. Inaddition, a LDLS can be used spectrometers or spectrographs to providelower noise than arc lamps currently used.

In some embodiments, a LDLS can be used with an absorption cell. Asystem using a LDLS with an absorption cell has the advantage that avery small cell can be used while still maintaining a high rate ofphoton flux through the cell due to the very high radiance, highbrightness, of the LDLS. Thus, smaller volumes of material are needed tocarry out an analysis in the cell, and for a given time resolution,lower flow rates are required. FIG. 35 is a schematic illustration of anabsorption cell 3500. An absorption cell has a vessel 3505 withtransparent walls 3506. The vessel 3505 can hold a gas or a liquid. Theabsorptivity or absorption spectrum of the gas or liquid can bemeasured. The absorption cell 3500 can contain one or more opticalwindows, 3510. In some embodiments the optical windows 3510 can let inlight from a light source 3520. In some embodiments the light source3520 is a LDLS. One of the windows 3510 can be illuminated by light 3530from the LDLS which is delivered to the window 3510 by an optical system(not shown). The optical system can include a combination of lenses,mirrors, gratings and other optical elements. The system can be afocusing mirror to focus the LDLS light into the absorption cell 3500while avoiding the chromatic aberration which can occur if a lens isused. The light 3530 can be detected by a detector 3540. The absorptioncell 3500 can be used as the sample cell 3680 in FIG. 36

In some embodiments, a LDLS can be used with a UV detector. FIG. 36 is aschematic illustration of a UV detector 3600. The UV detector 3600contains a light source 3610. In some embodiments the light source 3610is a LDLS. Light 3615 from the light source 3610 follows the path of thearrows in FIG. 36. For example, the light 3615 emitted from the lightsource 3610, contacts a first curved mirror 3620 and then a secondcurved mirror 3630. The light 3615 then contacts a diffraction grating3640 and returns to the second curved mirror 3630. The light 3615 thencontacts a first plane mirror 3650 and then a second plane mirror 3660.The light 3615 passes through a first lens 3670. In some embodiments,the first lens 3670 is a quartz lens. The light 3615 then enters asample cell 3680 and passes through a second lens 3690. In someembodiments, the second lens 3690 is a quartz lens. The light 3615 thenenters a photo cell 3695.

In some embodiments, a LDLS can be used with a diode array detector.FIG. 37 is a schematic illustration of a diode array detector 3700,according to an illustrative embodiment of the invention. In someembodiments, the diode array detector contains a light source 3710. Insome embodiments, the light source 3710 is a LDLS. In some embodimentsthe light 3715 from the light source 3710 passes through an achromaticlens system 3720 and then a shutter 3730. The light 3715 then enters aflow cell 3740 and then entrance aperture 3745. The light 3715 exits theentrance aperture 3745 and contacts a holographic grating 3750. Theholographic grating 3750 directs the light 3770 into a photo diode array3760.

In some embodiments, a LDLS can be used with a fluorescence detector.FIG. 38 is a schematic illustration of a fluorescence detector 3800,according to an illustrative embodiment of the invention. In someembodiments the fluorescence detector contains a light source 3810. Inone embodiment the light source 3810 is a LDLS. The light 3815 from thelight source 3810, passes through a first lens 3820. In someembodiments, the first lens 3820 is a quartz lens. The light 3815 thenpasses through a first window 3840 and enters chamber 3830. Some of thelight 3815 exits the chamber 3830 through a second window 3845. In someembodiments the first and second windows 3840, 3845 are made of quartz.Some of the light 3815 exits through a transparent wall of the chamber3830 and contacts a second lens 3850. The lens 3850 focuses the light3815. The light 3815 then enters photo cell 3860.

Variations, modifications, and other implementations of what isdescribed herein will occur to those of ordinary skill in the artwithout departing from the spirit and the scope of the invention asclaimed. Accordingly, the invention is to be defined not by thepreceding illustrative description but instead by the spirit and scopeof the following claims.

1. A method for illuminating features of a semiconductor wafer,comprising: ionizing a gas within a plasma chamber; providing laserenergy to the ionized gas to sustain a plasma within the plasma chamberto produce plasma-generated light; and illuminating the wafer with theplasma-generated light.
 2. The method of claim 1, further comprisingusing the plasma-generated light to measure the features of the wafer.3. The method of claim 1, further comprising using an optical element tofocus and modify a property of the laser energy directed to the ionizedgas.
 4. The method of claim 1, further comprising using an opticalelement to deliver the plasma-generated light from the chamber to awafer inspection system.
 5. The method of claim 1, wherein the laserenergy is from at least one laser selected from the group consisting ofan IR laser, a diode laser, a fiber laser, an ytterbium laser, a CO₂laser, a YAG laser, and a gas discharge laser.
 6. The method of claim 5,wherein the at least one laser emits at least one wavelength ofelectromagnetic energy that is strongly absorbed by the ionized gas. 7.The method of claim 1, wherein the gas is ignited to generate theionized gas without an ignition electrode and the laser energy from alaser source is used to ionize or excite the gas.
 8. The method of claim7, wherein the laser source comprises a continuous wave (CW) laser. 9.The method of claim 1, wherein the plasma-generated light comprisesultraviolet light.
 10. A method for measuring features of asemiconductor wafer, comprising: ionizing a gas within a plasma chamber;providing laser energy to the ionized gas to sustain a plasma within thechamber to produce plasma-generated light; and providing theplasma-generated light emitted by the ionized gas to a device selectedfrom the group consisting of a wafer inspection tool, a microscope, ametrology tool, and a lithography tool.
 11. The method of claim 10,further comprising using an optical element to focus and modify aproperty of the laser energy directed to the ionized gas.
 12. The methodof claim 10, wherein the gas is ignited to generate the ionized gaswithout an ignition electrode and the laser energy from a laser sourceis used to ionize or excite the gas.
 13. A system comprising: a plasmachamber having an ionized gas therein; a laser for providingsubstantially continuous energy to the ionized gas within the chamber tosustain a plasma and produce plasma-generated light; and a tooloptically coupled to the chamber that uses the plasma-generated light toilluminate a wafer.
 14. The system of claim 13, wherein the chambercontains one or more of a noble gas, Xe, Ar, Ne, Kr, He, D2, H2, O2, F2,a metal halide, a halogen, Hg, Cd, Zn, Sn, Ga, Fe. Li, Na, an excimerforming gas, air, a vapor, a metal oxide, an aerosol, a flowing media,or a recycled media.
 15. The system of claim 14, further comprisingmeans for igniting the gas to generate the ionized gas without anignition electrode and a laser source to ionize or excite the gas. 16.The system of claim 15, wherein the laser source comprises a continuouswave (CW) laser.
 17. The system of claim 13, wherein the laser comprisesat least one laser selected from the group consisting of an IR laser, adiode laser, a fiber laser, an ytterbium laser, a CO₂ laser, a YAGlaser, and a gas discharge laser.
 18. The system of claim 13, furthercomprising at least one optical element to focus and modify a propertyof the energy of the laser, the property selected from the groupconsisting of diameter, direction, divergence, convergence, orientation,and wavelength.
 19. The system of claim 13, further comprising at leastone optical element to modify a property of the plasma-generated lightemitted by the ionized gas as the plasma-generated light is delivered tothe tool.
 20. The system of claim 13, wherein the tool is selected fromthe group consisting of a wafer inspection tool, a microscope, ametrology tool, and a lithography tool.
 21. A plasma-based light sourcecomprising: a chamber configured to contain an ionized gas; a laser forgenerating a beam of laser energy; an optical system coupled to thelaser for modifying an optical property of the beam of laser energy, theoptical system configured to direct the beam to the ionized gas withinthe chamber in order to sustain in the chamber a plasma having anelongated form with a plasma length that is substantially greater thanthat of a plasma diameter; and a tool optically coupled to the chamberfor receiving light generated by the plasma.
 22. The light source ofclaim 21 wherein the optical system is configured to sustain theelongated plasma with the plasma length being at least an order ofmagnitude greater than that of the plasma diameter.
 23. The light sourceof claim 21 wherein the optical system is configured to adjust an angleof convergence of the beam of laser energy, thereby changing the plasmalength.
 24. The light source of claim 21 wherein the laser is configuredto generate a substantially continuous beam of laser energy.
 25. Thelight source of claim 21 wherein the optical system is configured tosustain the elongated plasma with the plasma length being at least 1millimeter and the plasma diameter being at least 0.1 millimeters.
 26. Amethod for producing light comprising: ionizing with an ignition sourcea gas within the chamber; providing laser energy to the ionized gaswithin the chamber to generate or sustain a plasma in the chamber; andproviding energy from the ignition source to the plasma in the plasmachamber.
 27. The method of claim 26 further comprising providingsufficient energy from the ignition source to the plasma to maintain adesired temperature of the plasma chamber.
 28. The method of claim 26further comprising operating the ignition source during operation of thelaser.
 29. The method of claim 26 further comprising providingsufficient energy from the ignition source to the plasma to maintain adesired pressure of gas or vapor within the plasma chamber.
 30. Themethod of claim 26 further comprising modifying an optical property ofthe laser energy within the chamber in order to sustain in the chamber aplasma having an elongated form with a plasma length that issubstantially greater than that of a plasma diameter.